1.The harm of humidity to electronic components and the whole machine
Most electronic products require operating and storage under dry conditions.According to statistics, more than a quarter of the world’s industrial manufacturing bad products are related to dampness.For the electronic industry, the dampness of the damage has been one of the main factors affecting the quality of the products.
(1) integrated printed circuit board: the dampness of moisture to the semiconductor industry is mainly manifested in the humidity that can penetrate into the IC interior through IC plastic packaging and from the pins and other gaps, producing IC moisture absorption phenomenon.
Water vapor builds up during the heating process of the SMT pcb assmblling process, creating pressure that causes the IC resin package to crack and oxidize the metal inside the IC device, resulting in product failure. In addition, when the device in the PCB board welding process, due to the release of water vapor pressure, will lead to Weld.
Based on IPC – M190 J – STD – 033 standard, the following exposure to air and humidity environment of SMD components, necessary to place it under 10% RH humidity exposure time is set in the oven that 10 times the time, “workshop” life of the element is to return to avoid scrap, ensure safety.
(2) LCD device:LCD screen LCD devices such as glass and polaroid, although filter in the process of production for cleaning drying, but after its cooling will still be affected by the moisture, reduce the percent of pass of the products.Therefore, it should be stored in a dry environment under 40%RH after cleaning and drying.
(3) other electronic components: capacitors, ceramic components, connectors, switches, soldering, PCB, crystal, silicon, quartz oscillator, SMT adhesive glue, electrode materials, electronic paste, high brightness devices, etc, all will be affected by the wet damage.
(4) electronic devices in the operation process: semi-finished products in the package to the next process;PCB packaging before and after encapsulation to connect;The IC, BGA and PCB that have not been used up after the disassemble;Waiting for the soldering device;The device that is ready to be returned to the temperature after baking;Unpacked finished products, etc., will be affected by the dampness.
(5) the finished products will also be damaged by the moisture during the warehousing process.If the storage time is too long in high humidity, it will cause the failure to occur, and the computer board cpus will cause the gold finger oxidation to cause the failure of contact.
The production of electronic industrial products and the storage environment of the products should be below 40%.Some varieties also require less humidity.
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