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PCB Bokaholimo Process Phekolo

 

Ka morero motheo oa PCB kalafo holim ke ho etsa bonnete ba weldability molemo kapa performance.Because motlakase koporo tsa tlhaho moeeng atisa ho ba ka sebōpeho sa oxides, ho ke ke ha etsahala hore ba lule ba koporo bakeng sa nako e telele, kahoo koporo e hlokahalang bakeng sa mekhoa ea phekolo e tse ling .

1.Hot Air ho batalatsa (HAL / HASL)
Hot moea batalatsa, tsejoang hape e le solder chesang moea batalatsa (tsejoang HAL / HASL), eo e tlotsitsoeng ka PCB holim futhumatsang entsoeng ka ho qhibilihisoa thini solder (etella pele) le sebelisa a petetswa moea ho kaofela (letse) a bataletseng theknoloji, ho etsa foromo lona mokato tsa koporo ho kena moea hanyetsa, 'me ka fana ka weldability tse molemo tsa' barbotage layer.The solder le koporo ba thehoa e kopanetsoeng ea ho theha e compound.The PCB lokela ho ikakhela ka setotsoana solder entsoeng ka ho qhibilihisoa nakong chesang moea conditioning.The moea thipa flushes le solder mokelikeli pele solder solidifies.The moea thipa ka fokotsa khumama tsa solder holim'a metsi koporo le ho thibela ho tjheseletsa borokho.

HASL Bokaholimo Phekolo PCB

2.Organic Weldable Sireletsa Agent (OSP)
OSP e hatisitsoeng oa potoloho boto (PCB) koporo foil holim kalafo ea mofuta ofe e le theknoloji ho kopana ditlhoko tsa RoHS directive.OSP ke khutsufatso ea Organic Solderability senyeha. E boetse e tsejoa e le Organic kulo filimi, tsejoang hape e le mosireletsi ea koporo, le tsejoang hape e le Preflux ka English.In ka Nutshell, ho OSP ke lik'hemik'hale fetotsoeng lera la letlalo manyolo holim'a hloekileng, bare copper.This filimi na le-ba khahlanong le ho kena moea, mogote makala le ho hanyetsa mongobo, e leng ho ka sireletsa holim koporo tloha mafome (ho kena moea kapa vulcanization) ka ho tloaelehile environment.But ka mocheso morago ga moo e tjheseletsa, filimi e sireletsang le ho tlameha ho ka potlako tlosoa ke ts'ebetsong habonolo, kahoo feela ka etsa hloekileng koporo holim 'a bontša ke ka nako e khutšoanyane haholo nako le solder entsoeng ka ho qhibilihisoa hang-hang ba tiileng solder manonyeletso.

OSP Bokaholimo Phekolo PCB

3.Full poleiti nikele / Gold
Plate nikele / Khauta e tlotsitsoe ka holim 'a PCB ebe tlotsitsoe ka mokato tsa khauta. The nikele plating ke haholo-holo ho thibela diffusion tsa khauta le copper.Now ho na le mefuta e 'meli ea khauta electroplating nikele: khauta bonolo plating (khauta, bokaholimo khauta sheba se khanyang) le khauta ka thata plating (holim'a e boreleli le thata, apara-hanela , na le likarolo tse ling tse kang cobalt, khauta shebahala leseli le eketsehileng) .Soft khauta e haholo-holo sebelisoa bakeng sa ladica i ambalaji terata khauta; The khauta ka thata e haholo-holo sebelisoa bakeng sa interconnection motlakase libakeng tse bao e seng tjheseletsa.

Feletseng Plate nikele Gold PCB

4.Immersion Gold
qoelisoa khauta e tlotsitsoeng ka e tenya, pellet ntle nikele-khauta motsoako holim'a metsi ea koporo, e leng ho ka sireletsa PCB bakeng sa nako e telele time.In phaella moo, ho na le mamello ya holim'a metsi kalafo tse ling phaella moo technologies.In, tebang khauta ka boela ho thibela ho shoa hoa koporo, e tla ba molemo ho etsa hore ntle kopano.

Ho qoelisoa Gold holim Phekolo PCB

5.Immersion Tin
Ho tloha solders kaofela li thehiloe thini, lera thini ka tšoanang mofuta ofe kapa ofe oa solder.Tin thulaganyou e pakeng tsa metsoako e bataletse koporo thini ka thehoa, tšobotsi ena e etsa thini boima o joaloka moea batalatsa chesang tsa weldability molemo 'me ha ho na moea chesang ho batalatsa flatness la bothata hlooho; qoelisoa thini ke ke ho bolokoa bakeng sa nako e telele haholo 'me e lokela ho ba bokana ho ea ka taelo ea Lokisa thini.

Ho qoelisoa Tin Bokaholimo Phekolo PCB

6.Immersion Silver
Tsela silevera pakeng barbotage manyolo le electroless nikele plating. Tshebetso e bonolo ebile fast.Even ha a pepesa ho futhumatsa, mongobo le tšilafalo, silevera ka lula weldability ntle empa o tla lahleheloa ke lona luster.The fumana silevera ha e na le hantle 'meleng matla tsa lik'hemik'hale plating nikele / tebang khauta hobane ho se na nikele tlas'a lera silevera.

7.ENEPIG (Electroless nikele Electroless Palladium qoelisoa Khauta)
Ha ho bapisoa le ENEPIG le ENIG, ho na le lera tlatsetso ya Palladium pakeng nikele le khauta. Palladium ka thibela lipono tse makatsang tsa ts'enyeho bakiloeng ke tloswa itšoara joang, 'me ho etsa ho lokisetsa e tletseng bakeng sa ho qoelisoa gold.Gold e haufi-ufi koahetsoeng ka Palladium, ho fana ka segokanyimmediamentsi sa sebolokigolo hantle.

8.Plating Hard Khauta
E le hore ho ntlafatsa qhoaele-hanela thepa ya sehlahiswa, eketsa nomoro ya kenyeletswa le plating khauta thata.

Plating Hard Gold Bokaholimo Phekolo PCB

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