Injongo esisiseko ye PCB unyango kumphezulu kukuqinisekisa weldability elungileyo okanye performance.Because wombane ubhedu zendalo emoyeni idla ngokuba ngohlobo oxides, akuthandeki ukuba ahlale ubhedu ixesha elide, ngoko nobhedu efunekayo ukuze imithi .
1.Hot Air unje (HAL / HASL)
Umoya Hot sokulinganisa, okwabizwa ngokuba umoya oshushu solder sokulinganisa (eyaziwa ngokuba HAL / HASL), nto leyo isale phezu PCB kumphezulu amalahle etyhidiweyo nebhekile solder (lead) nokusebenzisa zixinaniswe umoya yonke (ukwenza) technology tyaba, yenza ifomu yayo umaleko ukunganyangeki igcwala yobhedu, kwaye ukubonelela weldability ezilungileyo solder ukutyabeka layer.The nobhedu akhiwa kule edibeneyo ukwenza compound.The PCB kufuneka ukuxakeka solder otyhidiweyo ngexesha hot air conditioning.The umoya imela egungxula le solder ulwelo phambi kokuba solder solidifies.The imela umoya zinciphise ukugoba le solder kumphezulu yobhedu nokuthintela ukuwelda kwebhulorho.
2.Organic Weldable zokhuseleko nokuba umnye (osp)
osp Libhalwe circuit board (PCB) ngefoyile ye lobhedu unyango phezu uhlobo kwethekhinoloji ukuhlangabezana neemfuno RoHS directive.OSP kuyinto segama Organic Solderability ukubola. Kwakhona eyaziwa ngokuba umboniso ngelotha Organic, okwabizwa ngokuba umkhuseli nobhedu, okwabizwa ngokuba Preflux e English.In Ngamafutshane, le osp i inwebu iikhemikhali modified yonke yesikhumba lweziphili olwahlala kwamanzi acocekileyo, copper.This wamzalela ifilimu uye anti-igcwala, Njengokungeniswa thermal kunye nokumelana ukufuma, nto leyo ukukhusela umphezulu ubhedu irusi (igcwala okanye yokuhlanganisa) ngokwesiqhelo environment.But kwi ubushushu iwelding elandelayo, zokuphepha umboniso kwaye kufuneka ngokukhawuleza isuswe ngu ukubhobhoza lula, ukuze nje ukwazi ukwenza ecocekileyo umphezulu yobhedu swi na ixesha elifutshane kakhulu ixesha solder etyhidiweyo ngoko nangoko kuba amalungu solder esiqinileyo.
3.Full Plate Nickel / Gold
Plate nickel / Gold into engathi ngumfanekiswana phezu kwamanzi PCB waza wayaleka umaleko yegolide. Nesingxobo nickel kakhulu ukuthintela ukudibana zegolide copper.Now kukho iintlobo ezimbini electroplating nickel yegolide: (eqaqambileyo igolide, umphezulu igolide ubuhle hayi) nesingxobo ngegolide ethambileyo kunye nesingxobo negolide nzima (asuka kuyo ogudileyo kwaye kunzima, anxibe-ukunqaba , nezinye izinto ezifana ayibe, igolide ukhangela ukukhanya ngaphezulu) .Soft igolide esisetyenziselwa wire igolide chip sopakisho; igolide nzima isetyenziswa ikakhulu ngenxa zokuqhagamshelwa zombane kwiindawo ezingezo-welding.
4.Immersion Gold
ukuntywiliselwa igolide isale noboya, ingxubevange nickel-igolide ngombane elungileyo phezu zobhedu, nto leyo ukukhusela PCB ukuba time.In Ukongeza elide, it has nokunyamezela olunye unyango umphezulu technologies.In Ukongeza, ukutshona igolide kwakhona kuthintela ukuchithwa sobhedu, nto leyo eya kuba luncedo ukukhokela-free ibandla.
5.Immersion Tin
Ekubeni zonke solders zisekelwe inkcenkce, umaleko tin nga uzakuthelekisa naziphi uhlobo inkqubo solder.Tin phakathi ngobhedu flat iikhompawundi tin unako kuyilwa, lo msebenzi osemqoka wenza tin enzima iye njengomoya sokulinganisa evuthayo weldability elungileyo yaye akukho moya hot ilungelelanise flatness ingxaki yintloko ebuhlungu; ukuntywiliselwa tin ayikwazi ugcinwe ixesha elide kakhulu yaye kufuneka ndawonye ngokohlobo luka yokusombulula tin.
6.Immersion Silver
Inkqubo Isilivere phakathi zokwaleka eziphilayo electroless nickel nesingxobo. Le nkqubo ilula kwaye fast.Even xa zibethwa bubushushu, ukufuma kunye nongcoliseko, isilivere uyakwazi ukugcina weldability elungileyo kodwa uya kulahlekelwa luster.The wayo isilivere akanawo amandla elungileyo emzimbeni we-nickel imichiza nesingxobo / wayetshona igolide kuba akukho nickel phantsi umaleko yesilivere.
7.ENEPIG (Electroless Nickel Electroless palladium ukuntywiliselwa Gold)
Xa kuthelekiswa ENEPIG kunye ENIG, kukho umaleko eyongezelelweyo palladium phakathi nickel kunye negolide. Mbala kungavimbela isenzeko umhlwa ebangelwe indlela endaweni, nilungiselele elizeleyo ngokuntywiliselwa gold.Gold ngokusondeleyo alekwe palladium, ngokubonelela ujongano elungileyo.
8.Plating Hard Gold
Ukuze kuphuculwe banxibe-ukuxhathisa impahla imveliso, ukunyusa inani ufako nesingxobo ngegolide nzima.
