Re tshehetsa tloaelo PCB turnkey difeme tšebeletso kenyeletsa PCBA mochine o tsamaea hammoho le PCB mochine popontshwa, motsoako phumantsho le kopano. Nang le tsebo le matla ya tshebetso tlhahiso, hangata re ka bitsoa ke bareki ba rona ho ba tšehetsa le ditshebeletso PCBA Prototyping.
PCB mochine kopano re fana ka:
- PCBA tšebeletso mochine turnkey
- theko tlhōlisano
- Fast pelehi ba retelehelang kgaoletsang
- Free kgaoletsang qotsa
- Libaka tse Hloahloa tsa loketse tsela kulo
- Engineering cheke le teko
PCBA mochine bokgoni
Re na le mefuta e fapaneng sephara ea PCBA mochine thekenoloji ho akarelletsa BGA, 0201 le e metle sekontiri se metsi placement. Re tshehetsa bobeli mochini le sebaka letsohong likarolo. Ka letsoho la kulo, leqhubu & reflow kulo, mochine o kopano ea hao e tla molemo ka ho fetisisa o ile a lokisetsa ho ea ka likarolong tse ka thaepa le maemo.
| No | ntho | bokgoni |
| 1 | Single le habeli sekamela lehlakoreng le le SMT / PTH | E |
| 2 | likarolo kgolo ka mahlakoreng a mabeli, BGA ka mahlakoreng a mabeli | E |
| 3 | Nyenyane ka ho fetisisa Chips boholo | 0201 |
| 4 | Mets BGA le adimiwa BGA sekontiri se metsi le bolo bokelletse | 0,008 ka. (0.2mm) sekontiri se metsi, bolo bala moholo ho 1000 |
| 5 | likarolo mets Leaded hloma | 0,008 ka. (0.2 limilimithara) |
| 6 | Max Parts boholo kopano ka mochini | 2.2 ka. X, 2.2 ka. X, tse 0.6 ka. |
| 7 | Seboka holim eketseha dikgokelo | E |
| 8 | Makatsa foromo likarolo: LED Resistor le capacitor dinetweke tseo Electrolytic capacitors polygonal resistors le capacitors (lipitsa) Sockets |
E, Seboka ka matsoho |
| 9 | tsokoang kulo | E |
| 10 | Max PCB boholo | 14,5 ka. X, 19,5 ka. |
| 11 | Mets PCB botenya | 0,02 ka. |
| 12 | Marks Fiducial | Ba rata empa ho sa hlokahale |
| 13 | PCB qete: | 1. SMOBC / HASL 2.Electrolytic khauta 3.Electroless khauta 4.Electroless fumana silevera 5.Immersion khauta 6.Immersion thini 7.OSP |
| 14 | PCB Shape | leha e le efe |
| 15 | Panelized PCB | 1.Tab qhalakanya 2.Breakaway ditab 3.V-a recu 4.Routed + V-a recu |
| 16 | tlhahlobo | 1.AOI 2.X-ray and analysis 3.Microscope ho 20X 4.Function teko |
| 17 | Rework | 1.BGA tlosa 'me le eme Phetolo 2.SMT Ire rework seteishene 3.Thru-lesoba seteishene rework |