Hlau Core PCB

With the increase of the LED chip size and polycrystalline LED the development of packaging design, LED the heat load are also redouble,in addition to this the heat dissipation capacity of plate material, its thermal stability of materials are also affect the LED products’ life.In short, high power LED products loading board material needs to have at the same time the characteristics of high heat dissipation and high heat resistance, so the packaging substrate material becomes the key factor, on the application of traditional LED heat dissipation substrate,Hlau Core PCB be widely used.

Metal core printed circuit board PCB (you aslo can call it MCPCB , Thermal PCB, Heavy Tooj PCB) yog ib hom ntawm PCB board nrog hlau puag cov ntaub ntawv uas tsis woven iav FR4, FR3 los yog others.There yog ib mog, muab ob npaug rau mog, thiab multilayer Rooj Tswjhwm Saib cov. Cov feem ntau ntawm Metal Core PCB manufacturers are commonly used metal core material is aluminum, copper and alloy. Aluminum is the most frequently used among them due to its good heat transfer ability,dissipation ability and relatively cheaper costs than copper,even which may has a better performance,so it widely was accepted.copper although have better performance,but its cost more expensive,steel is more rigid than both aluminum and copper,it has normal steel and stainless steel,but its thermal conductivity is lower than others,simple speaking,aluminum material is the best choice,even considering from cost,rigidness and thermal conductivity.

There are single sided,two layer and multi-layer mcpcb,the Single sided metal core printed circuit board consists of a metal base (aluminum or copper alloy), dielectric layer, and copper conductor layer. The single layer MCPCB can be used with surface mount and chip & wire components. It provides much lower thermal resistance than FR4 PCB. And the metal core provides lower cost and allows much larger areas than ceramic substrates.

Hlau Core PCB yog siv los hloov cov tsoos FR4 los yog CEM3 PCBs vim hais tias ntawm cov muaj peev xwm nraaj dissipate tshav kub deb ntawm lub Cheebtsam. Qhov no yog tiav los ntawm kev siv ib tug thermally conductive dielectric txheej.

Lub prepreg dielectric muab kub zoo hloov los ntawm tus ntawv ci thiab Cheebtsam rau lub hauv paus phaj, thaum tswj zoo heev hluav taws xob kev rho tawm. Lub hauv paus txhuas los yog tooj liab phaj muab ib leeg-mog substrate txhua yam kev ncaj ncees, thiab muab thiab hloov lub cua sov rau lub tshav kub tog, mounting nto los yog ncaj nraim mus rau lub ambient cua.

Hlau Core PCB feature:

• Pib kev kho mob ntawm thermal diffusion nyob rau hauv PCB Circuit Court tsim
• Txo khiav hauj lwm kub, ua kom hwj chim ceev thiab kev cia siab, ntev lub neej ntawm cov khoom
• Me hneev taw, txo kho vajtse thiab los ua ke nqi
• Hloov lub cev tsis kho tej hub substrates PCB nrog zoo cov neeg kho tshuab durability

Hlau Core PCB daim ntaub ntawv:

• Teeb pom kev zoo: LED teeb yog lub biggest neeg siv ntawm Aluminium PCB
• Fais fab module: Fais fab Converters, Inverters, khoom hauv lub xeev relays, lub hwj chim rectifier choj
• Fais fab mov: switching regulator, DC / AC converter, SW regulator
• Kev sib txuas lus hluav taws xob khoom: high-zaus amplifier, lim cov khoom siv, transmitter circuits
• Suab khoom: tswv yim, tso zis amplifiers, kuas amplifiers, suab amplifiers, preamplifiers, lub hwj chim amplifiers
• Computer: CPU boards, muag nthas disk drives, fais fab mov pab kiag li lawm
• Chaw ua hauj lwm automation khoom siv: lub cev muaj zog drives ...
• Fais fab module: Inverters, khoom hauv lub xeev relays, lub hwj chim rectifier choj
• Tsheb: Hauv regulator, tiv cav tseb, lub hwj chim controllers ...

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