Tongasoa eto amin'ny KingSong PCB Teknolojia
Image: Advanced FR4 Material Black Soldermask PCB Boards Manufacturer
FR4 PCB ara-nofo no tena zavatra ho pirinty faritra board( PCBs ), ary maro karazana naoty sy toy ny TG130, TG150, High TG 170 sy 180 sns, indrindra Advanced FR4 Material Black Soldermask PCB Boards Manufacturer dia vokarina mampiasa glass- nanamafy epoxy laminate toy ny substrate, raha mbola misy maro samihafa ny laminates hita eny an-tsena, FR-4 dia sady zavatra maro sy tsara nanaiky ho toy ny fitsipika ara-nofo ho an'ny PCB fanamboarana . FR-4 asa tsara toy ny herinaratra insulator, ary manana hery tsara-to-lanja tahan'ny, ary lelafo mahatohitra.
Noho ny miha masiaka fifaninanana eo amin'ny tsena, mifanaraka amin'ny fitsipiky ny "avo fitantanana, hentitra fepetra, avo lenta, ka tsara fanompoana", sy mikely aina ny tombontsoa eo amin'ny tsena, ny teknolojia, sy ny talenta, KingSong manome ny mpanjifa amin'ny tsara indrindra kalitao ary ny fifadian-kanina vokatra sy ny tolotra.
1.Detail PCB Manufacturing Capabilities:
| No. |
Item |
Mass Production |
nitranga fahiny |
| 1 |
sosona |
1-8 sosona |
1-36 sosona |
| 2 |
Max. Panel Size |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board hateviny |
8.5mm |
8.5mm |
| 4 |
Min. Board hateviny |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Min Inner Layer Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
Min-dalana, sakany |
0.075mm (3/3 Mil) |
0.075mm (3/3 Mil) |
| 7 |
Min-dalana, toerana |
0.075mm (3/3 Mil) |
0.075mm (3/3 Mil) |
| 8 |
Min.Hole Size |
0.15mm (6mil) |
0.15mm (6mil) |
| 9 |
Min nopetahany takela lavaka hatevin'ny |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Min Blind / Nalevina haben'ny lavaka |
0.1mm (4mil) |
0.1mm (1-8layers) (4mil) |
| 11 |
Dia PTH. fandeferana |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Non PTH Dia. fandeferana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Hole Position fahadisoan-dàlana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
Heavy Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Min S / M dity |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
Soldermask loko |
Green, mainty, Blue, White, Yellow, Red |
Green, mainty, Blue, White, Yellow, Red |
| 17 |
Silkscreen loko |
White, Mavo, Mena, Black |
White, Mavo, Mena, Black |
| 18 |
drafitra |
Tambazotra, V-Groove, Beveling totohondriny |
Tambazotra, V-Groove, Beveling totohondriny |
| 19 |
Outline Tolerance |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
Peelable saron-tava |
Top, ambany, misy rindrina avo roa heny |
Top, ambany, misy rindrina avo roa heny |
| 21 |
voafehy Impedance |
+/- 10% |
+/- 7% |
| 22 |
Insulation Fanoherana |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Amin'ny alalan'ny Hole Resistance |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
mafana dona |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Tenany sy ny heviny |
≤0.7% |
≤0.7% |
| 26 |
Electric Strength |
> 1.3KV / MG |
> 1.4KV / MG |
| 27 |
Peel Strength |
1.4N / MG |
1.4N / MG |
| 28 |
Solder Mask Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
Test TOSIKARATRA |
50-330V |
50-330V |
2.PCB nitarika ny fotoana: (raha toa ka mila maika fanompoana, isika ihany koa dia afaka hihaona)
| Description |
Double Layer |
4 Layer |
6 Layer |
8 Layer |
10 Layer na ambony |
| Sample (WD) |
3-5 |
7 |
8 |
10 |
12 |
| Lamesa famokarana (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner banga fonosana, fitsipika ivelany boaty baoritra fonosana.
4.Shipping:
A: By DHL, UPS, Fedex, TNT sns
B: Ny ranomasina ho an'ny faobe be araka ny mpanjifa ny fepetra.
5.If mila PCB teny nindramina ho an'ny tetikasa, pls manome manaraka Info:
A: Quote dia be,
B: Gerber ampy amin'ny 274-X endrika,
C: fepetra ara-teknika na ny masontsivana (ara-nofo, sosona, varahina hatevin'ny,
birao hatevin'ny, ambonin'ny famaranana, solder saron-tava / silkscreen loko ...)
Raha misy manontany na te-hianatra bebe kokoa, azafady handefa mailaka ho antsika malalaka na hiresaka an-tserasera amin'ny alalan'ny rafitra, Misaotra noho ny fanohanana mialoha!
