Siyakwamukela KingSong PCB Technology
Image: Advanced FR4 Material Black Soldermask PCB Amabhodi Umkhiqizi
FR4 PCB impahla sisetshenziselwa izinto ezivamile ezibangela ephrintiwe wesifunda ibhodi( PCB ), futhi amamaki amaningi izinhlobo ezifana TG130, TG150, High TG 170 no-180 njll, iningi Advanced FR4 Material Black Soldermask PCB Amabhodi Umkhiqiziekhiqizwa usebenzisa glass- kwagcizelela epoxy laminate njengoba substrate, kuyilapho kukhona ezihlukahlukene laminates kuyatholakala emakethe, FR-4 kokubili okudingeka bashintshashintshe ngayo futhi kahle bamukelwa impahla indinganiso PCB womshini . FR-4 nemisebenzi kanye yisivikelo kagesi, futhi okuhle amandla i-isisindo isilinganiso, futhi amelana nomlilo.
Nge mncintiswano ngokuya enobuso emakethe, ngokuvumelana nesimiso esithi "ukuphathwa okusezingeni eliphezulu, izidingo esiqinile, izinga okusezingeni eliphezulu, futhi inkonzo enhle kakhulu", futhi ezikhandla zako e emakethe, ubuchwepheshe namakhono, KingSong inikeza amakhasimende ethu ne nqampuna umhlabeleli kanye nemikhiqizo okusheshayo kanye nezinsizakalo.
1.Detail PCB Ukukhiqiza amakhono:
Cha |
Into |
IMisa Production |
prototype |
1 |
Izinhla |
1-8 Izinhla |
1-36 Izinhla |
2 |
Max. Panel Usayizi |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
3 |
Max.Board wugqinsi |
8.5mm |
8.5mm |
4 |
Min. iBhodi wugqinsi |
2l: 0.3mm, 4L: 0.4mm, 6L: 0.8mm |
2l: 0.2mm, 4L: 0.4mm. 6L: 0.6mm |
5 |
Min Inner Layer Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
6 |
ububanzi min Line |
0.075mm (3/3 mil) |
0.075mm (3/3 mil) |
7 |
isikhala min Line |
0.075mm (3/3 mil) |
0.075mm (3/3 mil) |
8 |
Min.Hole Usayizi |
0.15mm (6mil) |
0.15mm (6mil) |
9 |
Min kuhlinzwa imbobo ukujiya |
20um (0.8mil) |
20um (0.8mil) |
10 |
Min Blind / Buried usayizi imbobo |
0.1mm (4mil) |
0.1mm (1-8layers) (4mil) |
11 |
PTH Dia. ukubekezelelana |
0.076mm ± (± 3mil) |
0.076mm ± (± 3mil) |
12 |
Non PTH Dia. ukubekezelelana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
13 |
Hole Isikhundla ukuphambuka |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
14 |
Heavy Coppe |
4oz / 140μm |
6oz / 175μm |
15 |
Min S / M Pitch |
0.1mm (4mil) |
0.1mm (4mil) |
16 |
Soldermask umbala |
Green, omnyama, Blue, Mhlophe, Yellow, Red |
Green, omnyama, Blue, Mhlophe, Yellow, Red |
17 |
umbala Silkscreen |
White, Yellow, Red, Black |
White, Yellow, Red, Black |
18 |
Uhlaka |
Yomgudu, V-Groove, Beveling Punch |
Yomgudu, V-Groove, Beveling Punch |
19 |
Uhlaka Tolerance |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
20 |
imaski Peelable |
Top, phansi, kabili emaceleni |
Top, phansi, kabili emaceleni |
21 |
impedance elawulwa |
+/- 10% |
+/- 7% |
22 |
Izinto zokuvala umoya Ukumelana |
1 × 1012Ω (Okuvamile) |
1 × 1012Ω (Okuvamile) |
23 |
Ngokusebenzisa Hole Ukumelana |
<300Ω (Okuvamile) |
<300Ω (Okuvamile) |
24 |
Shock Thermal |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
25 |
Warp futhi Twist |
≤0.7% |
≤0.7% |
26 |
Amandla kagesi |
> 1.3KV / mm |
> 1.4KV / mm |
27 |
Amandla ikhasi |
1.4N / mm |
1.4N / mm |
28 |
Solder imaski nemihuzuko |
> 6H |
> 6H |
29 |
Flammability |
94V-0 |
94V-0 |
30 |
Test Voltage |
50-330V |
50-330V |
2.PCB phambili isikhathi: (uma udinga isevisi esiphuthumayo, nathi singaqiniseka ukuhlangabezana)
incazelo |
Layer double |
4 Layer |
6 Layer |
8 Layer |
10 Layer noma ngaphezulu |
Sample (WD) |
3-5 |
7 |
8 |
10 |
12 |
ekukhiqizweni (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner cleaner emasakeni, engaphandle ejwayelekile ibhokisi ibhokisi nokupakisha.
4.Shipping:
A: ngu-DHL, UPS, Fedex, TNT njll
B: ngu ulwandle ayemaningi mass ngokuvumelana nemfuneko yekhasimende.
5.If isidingo ikhotheshini yamaphrojekthi wakho PCB, pls ukunikeza ulwazi olulandelayo:
A: Quote ubuningi,
B: ifayela Gerber e 274-x format,
C: imfuneko Technical noma imingcele (impahla, ungqimba, ithusi ukujiya,
ibhodi ukushuba, ebusweni yokuqedela, solder imaski / silkscreen umbala ...)
Uma kukhona uphenyo noma ufuna ukufunda okwengeziwe, sicela uthumele i-imeyili kithi ngokukhululekile noma uxoxe uhlelo inthanethi, sibonga ukwesekwa yakho kusengaphambili!