1. Njengoba i isixhumi ezibalulekile electronic, PCB isetshenziselwa imikhiqizo cishe zonke electronic, kubhekwa "unina imikhiqizo lukagesi," izinguquko zalo kwezobuchwepheshe kanye yemakethe babé kwagxilwa amabhizinisi amaningi.
Okwamanje, kunezinhlobo Amathrendi ezimbili asobala imikhiqizo electronic: umuntu mncane futhi okufutshane, elinye imvamisa high, high speed drive PCB esezansi ngokufanele ukuze high density, ukuhlanganiswa okusezingeni eliphezulu, encapsulation, ezicashile, futhi isiqondiso babhekane nezinga elikhulu amaningi, nesidingo esikhulayo phezulu PCB ungqimba kanye HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. Njengamanje, PCB is ikakhulukazi esetshenziselwa izinto zasendlini, PC, ideskithophu kanye neminye imikhiqizo ye-elektroniki, ngenkathi izicelo ephezulu ezifana nokusebenza okusezingeni multi-indlela amaseva kanye nezindiza mkhathi kudingeka ukuba abangaphezu kuka-10 zamatshe PCB.Take iseva njengesibonelo, ibhodi PCB kuseva olulodwa futhi ezimbili indlela ngokuvamile phakathi 4-8 izingqimba , kuyilapho ibhodi oyinhloko iseva ephezulu, ezifana 4 futhi 8 imigwaqo, kudinga okungaphezu 16 izingqimba , kanye backplate imfuneko ingaphezu 20 izingqimba.
HDI wiring ukuminyana isihlobo ukuba abavamile multilayer PCB ibhodi kunezinzuzo sobala, okuyinto choice eyinhloko mainboard zamanje smartphone.Smartphone umsebenzi ngokuya eziyinkimbinkimbi nevolumu ku ukuthuthukiswa engasindi, isikhala esincane ibhodi main, zidinga wanciphisa ethwele ngaphezulu yezingxenye ebhodini main, abavamile multi-ungqimba ibhodi bekulokhu kunzima ukuhlangabezana nesidingo.
Isidlulisilwazi interconnection wesifunda ibhodi (HDI) usebenzisa laminated zomthetho uhlelo ibhodi, ezejwayelekile multilayer ibhodi njengoba nje nengaphakathi ibhodi ukustaka, ukusetshenziswa imishini, futhi imbobo metallization inqubo, okwenza zonke zamatshe umngcele ophakathi yangaphakathi uxhumano umsebenzi. Kuqhathaniswa ezivamile ngokusebenzisa-imbobo kuphela amabhodi multilayer PCB, HDI usetha ngokunembile inani-VIAS angabaholi abayizimpumputhe e-VIAS wangcwatshwa ukunciphisa isibalo-VIAS, silondoloza PCB isakhiwo endaweni, futhi kakhulu kwandisa ingxenye ukuminyana, ngaleyo ndlela ngokushesha kokuqeda ukusebenza multilayer Smartphones laminating izindlela. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular eminyakeni yamuva e-HDI ephezulu smartphone ungqimba ngokungenasizathu is aphakeme embondelene of HDI, angadinga noma yimuphi zinemigodi izimpumputhe uxhumano phakathi izingqimba eduze, ngesisekelo HDI abavamile asisindise esicishe sibe ingxenye yenkathi ivolumu, ukuze kube nendawo enkudlwana ibhetri kanye nezinye izingxenye.
Noma yimuphi ungqimba HDI kudinga ukusetshenziswa ubuchwepheshe eziphambili ezifana laser imishini futhi electroplated imbobo plugs, okuyinto ukukhiqizwa kunzima kakhulu futhi aphakeme value-added HDI uhlobo, okungaba umhlabeleli kubonise izinga lobuchwepheshe HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. Futhi izimoto ezintsha amandla umele isiqondiso imoto kagesi, uma iqhathaniswa naso imoto bendabuko, isicelo ephakeme level electronic, zobuchwepheshe yendabuko Limousine izindleko zaba ngu-25%, 45% kuya ku-45% kule izimoto ezintsha amandla , eyingqayizivele uhlelo lokulawula amandla (BMS, VCU futhi MCU), kwenza ukusetshenziswa imoto PCB kukhulu kunenani imoto yendabuko, ezintathu ukulawula amandla uhlelo PCB ukusetshenziswa isilinganiso mayelana 3-5 square metres, inani imoto PCB Phakathi 5-8 square metres.
4. Ukwanda ADAS nezimoto amandla amasha, eliqhutshwa namasondo amabili, uye waqhubeka futhi yezimoto electronics emakethe ekhula ngesilinganiso yonyaka amaphesenti angaphezu kuka-15 e yamuva years.Accordingly, ezimakethe PCB uzoqhubeka phezulu, futhi kuba wabikezela ukuthi lesi ukukhiqizwa PCB ziyoyidlula $ 4 billion ngonyaka 2018, futhi lo mkhuba ukukhula kucacile kakhulu, ujova umfutho amasha umkhakha PCB.
5. Ama-smartphone bebelokhu yokushayela ezinkulu umkhakha PCB zangenkathi past.Mobile Inthanethi, abasebenzisi abaningi ngokwengeziwe PC mobile imishini esibulalayo, isimo PC Computing platform ngokushesha indawo yabo yathathwa ukugcina mobile, kusukela ngo-2008, umthengi global zikagesi kwamabhizinisi ukuthuthukiswa okusheshayo, ikakhulukazi 2012 ~ 2014, smartphone ku infiltration.Therefore okusheshayo, nokwanda okusheshayo kwenani PCB is eliqhutshwa ezansi terminals mobile emelelwa smart phones.Between 2010 no-2014, emakethe smartphone ezansi PCB safinyelela-avareji yonyaka kwakwakhe ukukhula ngesilinganiso 24%, kakhulu uma siqhathaniswa nezinye izimboni esezansi, ukuhlinzeka main ukukhula abashayeli ngemboni PCB.
Ngo ephezulu PCB, HDI, isibonelo, iselula kuyinto HDI emakethe wendabuko, ngo-2015, isibonelo, Smartphones zaba ngaphezu kwesigamu ingxenye, futhi ngokombono amafoni smart, imisebenzi emisha samanje cishe yonke imikhiqizo usebenzisa HDI njengoba umbadlana.
Bobabili ngokombono PCB futhi ephezulu HDI, kuba ijubane eliphezulu ukukhula smartphone eholela nesidingo ukuchuma esezansi, ngaleyo ndlela ukusekela ukukhula global PCB inzuzo amabhizinisi.
Kodwa kukhona Akuthandabuzwa ukuthi emakethe smartphone uye ehlile njengoba 2014, ngemva okusheshayo kokuziphatha esikhathini kanye entry kancane kancane Smartphones phakathi era.On isitokwe ezimakethe zomhlaba, isibikezelo zakamuva ezivela IDC2016 owakhishwa ngo-November 2016, i-global smartphone izimpahla ngo-2016 kulindeleke ukuba bhiliyoni 1.45, nge gxuma okuphawulekayo ukukhula percent.In 0.6 nje ngokuya idatha ukukhula, nakuba ingxenye kwezicelo PCB sika esezansi namanje kusekelwa mobile phones, izigaba kakhulu PCB, kuhlanganise HDI sebehlise ku mobile endaweni esigungwini.
Nakuba umongo nesimo sokwehla komnotho, smartphone umkhakha phakathi nengxenye yesibili kuzenzakalele, kodwa ngesisekelo stock enkulu, ngenxa ukuboniswa umphumela nezinye abathengisi ukuze silandele udaba lwakhe, funa umthengi ngeke ashayele replacement.The isitokwe enkulu emakethe amafoni smart usenayo ezingaba omkhulu, kanye nabathengisi terminals abazokwenza konke okusemandleni abo ukuthuthukisa abathengi 'ubuhlungu amaphuzu ukuze sikhuthaze okufunekayo sokudonsa emakethe share.As yalokho, smart phone, njengoba isicelo main ezansi PCB esikhathini esidlule, isethubeni elikhulu ukukhula PCB enkulukazi isitokwe umngcele.
Phakathi nale minyaka emibili noma emithathu, smart ukuthuthukiswa ifoni mkhuba, ukuqashelwa zeminwe, 3D Touch, isikrini esikhulu, ikhamera ezimbili nezinye emisha okuqhubekayo iye abasafufusa, kodwa futhi siqhubeke zishukumisa esikhundleni okuthuthukile.
Emongweni bamaselula ngokufaka engu-stock, esikhulu ivolumu isisekelo enquma ukuthi ukukhula isihlobo okubangelwa emisha ukuthengisa amaphuzu isazoqhubeka kuholele ukukhuphuka okukhulu ubuningi eliphelele demand.Stock emisha sithinta PCB global, uma esikhathini esizayo smartphone emisha yokuthuthukisa e PCB, ucabangela nomkhiqizi iselula usayizi mpahla esiphuthumayo ekhona futhi izifundo zokulandelisa ngeke, emisha yokuthuthukisa ukuphuthumisa Ukungena, ngaleyo ndlela avela afana optical, acoustic, njll
6. Ukugxila PCB umkhakha, kokugqashuka FPC futhi iyiphi ungqimba interconnection HDI ekhanga ezinye abakhiqizi ukuze silandele udaba lwakhe, futhi iphuzu akhanye ebusweni ukwakha umfuziselo Ukungena okusheshayo:
FPC yaziwa nangokuthi "PCB nezimo", kuyinto nezimo polyimide noma i-polyester ifilimu base impahla eyenziwe a nezimo ephrintiwe wesifunda ibhodi, ne-high density ezintanjeni zikagesi ezinde ezingaphansi, isisindo ekukhanyeni, ukujiya mncane, nezimo, eguquguqukayo okusezingeni eliphezulu sonkana ukuze isimo umkhiqizo electronic engasindi, mkhuba nezimo.
Asetshenziswa iPhone yayo-16 izingcezu FPC, izindlela ezingezona zokuthenga kuyinto FPC, eziyisithupha emhlabeni ngobukhulu emhlabeni phezulu FPC kwabakhiqizi amakhasimende eziyinhloko abakhiqizi ezifana apula, Samsung, Huawei, Na ngaphansi apula ukuboniswa sizazise FPC wako Smartphones.
Smartphone njengoba primary ukushayela force, ukukhula FPC kunenzuzo kusuka apula kanye ukuboniswa imiphumela yako, FPC igcwale ngokushesha, 09 singalondoloza ukukhula okusezingeni eliphezulu, minyaka yonke kusukela ngo-iminyaka engu-15 njengoba nje ibala elikhanyayo e PCB umkhakha, waba kuphela isigaba omuhle ukukhula .
7. substrate-Like PCB (ezibizwa ngokuthi SLP) e ubuchwepheshe HDI, esekelwe inqubo M-SAP, ungaqhubeka ukulungisa line, isizukulwane esisha umugqa omncane ephrintiwe wesifunda ibhodi.
Ibhodi ekilasini (SLP) yisizukulwane esilandelayo PCB hardboard, okungase mfushane kusukela 40/40 microns of HDI ukuze 30/30 microns.From inqubo umbono, ekilasini ukulayisha ibhodi eduze asetshenziswe Semiconductor emaphaketheni IC ebhodini, kodwa nokho ukufinyelela IC lwemininingwane ebhodini umthwalo, futhi injongo yayo isaqhubeka zonke izinhlobo izingxenye yokwenziwa, umphumela main namanje kungokwalabo esigabeni we PCB.For lokhu entsha umugqa omncane wokunyathelisa ipuleti isigaba, siyakufa ahumushe Ubukhulu ezintathu yokungenisa ingemuva, inqubo yayo yokukhiqiza kanye suppliers.Why ezingaba ingabe ufuna ukungenisa ekilasini umthwalo ibhodi: elicwengiweyo kakhulu umugqa superposition SIP nezimfuneko emabhokisini high density namanje emgqeni main, amafoni smart, amaphilisi, kanye namadivayisi wearable neminye imikhiqizo electronic ukuthuthukisa bebheke miniaturization futhi muti_function ushintsho, aqhubekisele phambili isibalo izingxenye is ayelokhu anda kakhulu ngoba isikhala wesifunda ibhodi, Nokho, bayanda elinganiselwe.
Kulo mongo, PCB wire ububanzi, Isikhala, ububanzi we panel micro ibanga imbobo isikhungo, futhi ungqimba umqhubi kanye ukushuba ekuvikeleni ungqimba abawayo, okuyinto enze PCB ukwehlisela usayizi, isisindo kanye ivolumu izimo, angazamukela components.As ngaphezulu komthetho Moore sika iwukuba semiconductors, high density kuyinto ukuphishekela ephikelelayo wesifunda amabhodi ephrintiwe:
Kakhulu izidingo wesifunda enemininingwane ziphakeme kunezindlela ukuminyana HDI.High ushayela PCB ithuba lokucwengisiswa emgqeni, futhi iphimbo ibhola (BGA) mfushane.
Ngo eminyakeni embalwa edlule, i-0.6 mm kuya 0.8 mm iphimbo ubuchwepheshe iye yasetshenziswa amadivaysi ephathwayo, lesi sizukulwane kwamafoni smart, ngoba nenani-I / O ingxenye futhi umkhiqizo miniaturization, PCB kabanzi USEBENZISA ubuchwepheshe 0.4 mm phezulu. Lo mkhuba ekuthuthukiseni maqondana 0.3mm. Eqinisweni, ukuthuthukiswa 0.3mm ubuchwepheshe esikhaleni ngenxa ezikhumulweni yeselula begun.At kakade ngesikhathi esifanayo, ubukhulu micropore futhi ububanzi we disc yokuxhuma aye ancipha 75 mm kuya ku-200 mm ngokulandelana.
Umgomo Imboni sika ukulahla micropores futhi akwazi ukugcina kuya 50mm kanye 150mm ngokulandelana ezilandelayo ezimbalwa years.The 0.3mm Isikhala design sebhithi kudinga ukuthi ulayini ububanzi Umugqa 30 / 30μm.
yena ekilasini ibhodi kuvumelana SIP emaphaketheni sebhithi more.SIP ezingeni uhlelo emaphaketheni ubuchwepheshe, esekelwe kwencazelo ngamazwe Semiconductor umugqa inhlangano (ITRS): SIP for izingxenye multiple asebenzayo electronic anemisebenzi ehlukahlukene nokuthi izingxenye ozikhethela yokwenziwa, namanye amadivayisi ezifana MEMS noma optical kudivayisi igunya ndawonye, ukufeza umsebenzi othile we emaphaketheni olulodwa ejwayelekile, ubuchwepheshe emaphaketheni ukwakha uhlelo noma subsystem.
Kujwayele ukuthi kube izindlela ezimbili ukuqaphela umsebenzi ngekhompuyutha, umuntu SOC, futhi uhlelo electronic yaqaphela ku chip olulodwa integration.Another high SIP, okuyinto luhlanganisa CMOS nezinye izifunda okuhlangene kanye nezinto zikagesi ibe iphakethe usebenzisa avuthiwe inhlanganisela noma interconnection ubuchwepheshe, okungase sifinyelele sonke emshinini umsebenzi ngokusebenzisa imbondela parallel chips ahlukahlukene sokusebenza.
Ibhodi ekilasini kungokwalabo PCB hardboard, futhi inqubo salo phakathi oda okusezingeni eliphezulu HDI kanye IC plate, kanye ephezulu HDI abakhiqizi futhi abakhiqizi ibhodi IC nethuba iqhaza.
abakhiqizi HDI kuthiwa ashukumisayo ngaphezulu, isivuno uzobe key.Compared ezine-IC ipuleti, HDI sekwande wokuncintisana futhi uye waba emakethe ulwandle obomvu, ne inzuzo engenayo declining.Face ibhodi ekilasini ukulayisha, ithuba of HDI abakhiqizi okusemandleni ukuze uthole entsha Ama-oda, isandla esisodwa, ngakolunye uhlangothi ingafinyelela umkhiqizo kokuthuthukisa, iqhakambisa ukuxuba umkhiqizo kanye nezinga nomholo, Ngakho-ke uhlose namandla, namandla kakhulu kusakhiwo kuqala.
Ngenxa inqubo ephakeme ekilasini ukulayisha ibhodi, HDI abakhiqizi ukutshala noma imishini emisha yokukhiqiza ukuguqulwa, futhi MSAP inqubo ubuchwepheshe abakhiqizi HDI futhi kudinga ukufunda isikhathi, indlela nokukhupha benze MSAP, umkhiqizo isivuno kuyoba ukhiye.
8. LED ukuthuthukiswa ngokushesha okusezingeni eliphezulu ezishisayo conductivity CCL abe spot.The ashisayo Isikhala encane LED has izinzuzo unspelt, ezinhle isibonisi umphumela nokuphila isikhathi eside. Eminyakeni yamuva, isiqalile ukuba igcwale, futhi liye landa ngesivinini. Ngenxa yalokho, kudingeka okusezingeni eliphezulu ezishisayo conductivity CCL isibe hot spot.
Imoto PCB phezu lomkhiqizo nokwethembeka nezimfuneko zibukhali kakhulu, futhi ukusetshenziswa ngaphezulu ekhethekile ukusebenza izinto CCL.Automotive electronics kuyinto PCB zokusebenza ezibalulekile nomfula. imikhiqizo Izithuthi electronic kumelwe baqale bahlangabezane yezimoto njengoba indlela yokuthutha kumelwe abe nezici lokushisa, isimo sezulu, voltage iyehla iyenyuka, ukuphazamiseka kagesi, vibration nezinye ikhono oluhambelana yezimfuneko ephakeme for yezimoto PCB izinto ukubeka izidingo phambili ephakeme, ukusetshenziswa kabanzi Special ukusebenza izinto (ezifana okusezingeni eliphezulu Tg izinto, (onomfutho asbestos fibre) izinto-CAF anti, izinto zethusi uqweqwe izinto ngobumba, njll) CCL.