Wilujeng sumping di KingSong PCB Téhnologi
Gambar: Double sided OSP Satengah Hole Circuit Board Jeung impedansi Control
2 lapisan dewan OSP PCB Ieu dipake dina Aplikasi Industrial, kayaning Electronic Tuner, produk controller calakan, A PCB Circuit Board Jeung OSP Surface finish mangrupakeun palapis antara komponén sarta dewan pcb bulistir, impedansi Control na Satengah liang Plated di ujung dewan bakal téknologi husus tur kompléks mangsa proses produksi, tapi anu henteu naon masalahna keur urang salaku produsén pCB profésional, urang teu ukur nyadiakeun layanan pcb kaku, tapi ogé nawarkeun pcb manufaktur fléksibel & jasa dirakit pinuh.
Sorangan 1.Detail PCB Manufaktur:
| No |
barang |
Produksi masal |
prototipe |
| 1 |
lapisan |
1-8 Lapisan |
1-20 Lapisan |
| 2 |
Max. Ukuran panel |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board ketebalan |
8.5mm |
8.5mm |
| 4 |
Mnt. dewan ketebalan |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Mnt Batin Lapisan clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
lebar mnt Line |
0.1mm (4/4 Mil) |
0.075mm (3/3 Mil) |
| 7 |
spasi mnt Line |
0.1mm (4/4 Mil) |
0.075mm (3/3 Mil) |
| 8 |
Ukuran Min.Hole |
0.15mm (8mil) |
0.1mm (6mil) |
| 9 |
Mnt plated ketebalan liang |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Mnt Buta / ukuran liang Dikubur |
0.2mm (8mil) |
0.2mm (1-8layers) (8mil) |
| 11 |
Mean ka-p Omod. kasabaran |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Mean ka-p Omod non. kasabaran |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Liang Posisi simpangan |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
beurat Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Mnt S / M pitch |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
warna Soldermask |
Héjo, hideung, Bulao, bodas, Yellow, Beureum |
Héjo, hideung, Bulao, bodas, Yellow, Beureum |
| 17 |
warna Silkscreen |
Bodas, Yellow, Beureum, Hideung |
Bodas, Yellow, Beureum, Hideung |
| 18 |
Outline |
Routing, V-legok, Beveling punch |
Routing, V-legok, Beveling punch |
| 19 |
Outline kasabaran |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
topeng Peelable |
Top, handap, ganda sided |
Top, handap, ganda sided |
| 21 |
dikawasa impedansi |
+/- 10% |
+/- 7% |
| 22 |
insulasi Résistansi |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Ngaliwatan Résistansi Hole |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
Manten termal |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Lungsi jeung pulas |
≤0.7% |
≤0.7% |
| 26 |
Kakuatan listrik |
> 1.3KV / mm |
> 1.4KV / mm |
| 27 |
Kakuatan mesek |
1.4N / mm |
1.4N / mm |
| 28 |
Solder Topeng Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
test tegangan |
50-330V |
50-330V |
2.PCB waktos kalungguhan: (lamun perlu layanan urgent, urang ogé bisa papanggih)
| gambaran |
ganda Lapisan |
4 Lapisan |
6 Lapisan |
8 Lapisan |
10 Lapisan atawa luhur |
| Sampel (WD) |
4 |
7 |
8 |
10 |
12 |
| Produksi masal (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: packing vakum Batin, Outer standar kotak karton packing.
4.Shipping:
A: Ku DHL, UPS, Fedex, TNT jeung sajabana
B: Ku laut pikeun kuantitas massa nurutkeun sarat customer urang.
5.If kedah petik pikeun proyék-proyék PCB anjeun, PLS nyadiakeun inpo di handap:
A: Quote kuantitas,
B: file Gerber dina 274-x format,
C: sarat Téknis atanapi parameter (bahan, lapisan, ketebalan tambaga,
ketebalan dewan, pagawean beungeut cai, solder topeng / warna silkscreen ...)
Mun sagala panalungtikan atanapi hoyong diajar, mangga ngirim email ka kami kalawan bébas atawa ngobrol ku sistem online, hatur nuhun kanggo pangrojong Anjeun sateuacanna!
