Tongasoa eto amin'ny KingSong PCB Teknolojia
Image: Double-misy rindrina OSP antsasany faritra Hole Board Amin'ny Impedance Control
Izany 2 sosona OSP PCB board ampiasaina amin'ny indostria Application, toy ny Electronic Tuner, tsaina Controller vokatra, A PCB faritra Board Amin'ny OSP tena toetrany Vitao ny dia ho mora eo amin'ny singa sy ny mangadihady PCB birao, Impedance Control ary ny antsasany Holes nopetahany takela teo an-tsisin'ny ny birao dia ho sarotra ny manokana sy ny teknolojia, nandritra ny dingana famokarana, fa tsy misy olana ho antsika toy ny matihanina PCB mpanamboatra isika, dia tsy vitan'ny hoe manome tolotra PCB henjana, fa koa manolotra malefaka PCB orinasa mpamokatra entana, sy feno tolotra tafavory.
1.Detail PCB Manufacturing Capabilities:
| No. |
Item |
Mass Production |
nitranga fahiny |
| 1 |
sosona |
1-8 sosona |
1-20 sosona |
| 2 |
Max. Panel Size |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board hateviny |
8.5mm |
8.5mm |
| 4 |
Min. Board hateviny |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Min Inner Layer Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
Min-dalana, sakany |
0.1mm (4/4 Mil) |
0.075mm (3/3 Mil) |
| 7 |
Min-dalana, toerana |
0.1mm (4/4 Mil) |
0.075mm (3/3 Mil) |
| 8 |
Min.Hole Size |
0.15mm (8mil) |
0.1mm (6mil) |
| 9 |
Min nopetahany takela lavaka hatevin'ny |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Min Blind / Nalevina haben'ny lavaka |
0.2mm (8mil) |
0.2mm (1-8layers) (8mil) |
| 11 |
Dia PTH. fandeferana |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Non PTH Dia. fandeferana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Hole Position fahadisoan-dàlana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
Heavy Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Min S / M dity |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
Soldermask loko |
Green, mainty, Blue, White, Yellow, Red |
Green, mainty, Blue, White, Yellow, Red |
| 17 |
Silkscreen loko |
White, Mavo, Mena, Black |
White, Mavo, Mena, Black |
| 18 |
drafitra |
Tambazotra, V-Groove, Beveling totohondriny |
Tambazotra, V-Groove, Beveling totohondriny |
| 19 |
Outline Tolerance |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
Peelable saron-tava |
Top, ambany, misy rindrina avo roa heny |
Top, ambany, misy rindrina avo roa heny |
| 21 |
voafehy Impedance |
+/- 10% |
+/- 7% |
| 22 |
Insulation Fanoherana |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Amin'ny alalan'ny Hole Resistance |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
mafana dona |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Tenany sy ny heviny |
≤0.7% |
≤0.7% |
| 26 |
Electric Strength |
> 1.3KV / MG |
> 1.4KV / MG |
| 27 |
Peel Strength |
1.4N / MG |
1.4N / MG |
| 28 |
Solder Mask Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
Test TOSIKARATRA |
50-330V |
50-330V |
2.PCB nitarika ny fotoana: (raha toa ka mila maika fanompoana, isika ihany koa dia afaka hihaona)
| Description |
Double Layer |
4 Layer |
6 Layer |
8 Layer |
10 Layer na ambony |
| Sample (WD) |
4 |
7 |
8 |
10 |
12 |
| Lamesa famokarana (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner banga fonosana, fitsipika ivelany boaty baoritra fonosana.
4.Shipping:
A: By DHL, UPS, Fedex, TNT sns
B: Ny ranomasina ho an'ny faobe be araka ny mpanjifa ny fepetra.
5.If mila PCB teny nindramina ho an'ny tetikasa, pls manome manaraka Info:
A: Quote dia be,
B: Gerber ampy amin'ny 274-X endrika,
C: fepetra ara-teknika na ny masontsivana (ara-nofo, sosona, varahina hatevin'ny,
birao hatevin'ny, ambonin'ny famaranana, solder saron-tava / silkscreen loko ...)
Raha misy manontany na te-hianatra bebe kokoa, azafady handefa mailaka ho antsika malalaka na hiresaka an-tserasera amin'ny alalan'ny rafitra, Misaotra noho ny fanohanana mialoha!
