1. Sezvo inokosha zvemagetsi connector, pcb rinoshandiswa kwerinenge zvose zvemagetsi zvigadzirwa, runoonekwa "amai zvigadzirwa ezvinhu zvigadzirwa," ayo kwezvinhu kuchinja uye musika yokurera vava ainyanya pfungwa mabhizimisi akawanda.
Pari zvino pane vaviri kuitika pachena mune zvemagetsi zvigadzirwa: mumwe mutete uye pfupi, mumwe ari kumusoro kakawanda, kumhanya nemotokari nomurwizi pcb maererano yakakwirira arambe achirema, mukuru kusangana, encapsulation, anokunyengedzera, uye nhungamiro vakawanda stratification, kukura kudiwa pamusoro rukoko pcb uye HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. Parizvino, pcb dzinowanzotsigi- kushandiswa imba midziyo yemagetsi, PC, pakombiyuta uye zvimwe zvigadzirwa zvigadzirwa, apo kumusoro-magumo zvikumbiro akadai mukuru waivako multi-nzira servers uye Aerospace vanofanira kuva anopfuura 10 akaturikidzana kuna PCB.Take ari Server somuenzaniso, kuti pcb bhodhi iri chete uye vaviri-nzira Server iri kazhinji pakati 4-8 akaturikidzana , apo huru bhodhi mukuru-mugumo Server, akadai 4 8 uye migwagwa, zvinoda zvinopfuura 16 akaturikidzana , uye backplate chinodiwa pamusoro 20 akaturikidzana.
HDI wiring arambe achirema hama kuti vanhuwo multilayer pcb bhodhi rine mikana pachena, inova huru kusarudza mainboard pakati ano smartphone.Smartphone mashandiro kuwedzera kunzwisisa uye vhoriyamu lightweight kukura, zvishoma uye zvishoma nzvimbo huru puranga, zvaanoitawo zvishoma akatakura zvimwe zvakamisa hurongwa pamusoro main puranga, vanhuwo zvavo multi-rukoko bhodhi zvave zvakaoma kusangana kudiwa.
High arambe achirema interconnection redunhu bhodhi (HDI) adopts ari laminated pamutemo hurongwa puranga, kuti vanhuwo multilayer bhodhi sezvo makirisito bhodhi kuisira, kushandisa kuchera, uye gomba metallization muitiro, zvichiita akaturikidzana dzose mutsetse pakati dzomunyika kubatana ishande. Tichienzanisa kwakajairika kuburikidza-buri chete multilayer PCB mapuranga, HDI zvakarurama anogadza uwandu mapofu vias uye akavigwa vias kuderedza uwandu vias, anoponesa pcb marongerwo nharaunda, uye yekudyidzana kunowedzera chinoumba arambe achirema, saka nokukurumidza ndakapedza multilayer oparesheni mu smartphones Laminating zvinotsiva. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular mumakore achangopfuura pamatunhu-kuguma smartphone zvemasanga rukoko HDI iri-soro zvinobva zvarongwa kuti HDI, inoda chero vane mapofu maburi papi pedyo akaturikidzana, pahwaro zvavo HDI aizovaponesa anoda kusvika hafu bhuku kuti nzvimbo nokuti bhatiri nezvimwe zvikamu.
Chero paiva HDI zvinoda kushandiswa yepamusoro ruzivo akadai Laser kuchera uye electroplated buri plugs, inova kugadzirwa chinonetsa uye inonyanya kukosha-akawedzera HDI mhando, izvo zvinogona zvakanaka kuratidza hwokugadzira pamwero HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. Zvino simba motokari itsva iri anomiririra kutungamirirwa yemagetsi motokari, zvichienzaniswa zvetsika motokari, chikumbiro yakakwirira zvigadzirwa chechetere, mune zvetsika URA mari zvemagetsi chakaita kuti anenge 25%, 45% kusvika 45% munyika itsva simba nemotokari , nemamwe simba kudzora mamiriro (BMS, VCU uye MCU), anoita motokari pcb mashandisirwo yakakura kupfuura zvetsika motokari, vatatu simba kudzora mamiriro pcb kushandiswa avhareji vanenge 3-5 mativi metres, uwandu motokari pcb Between 5-8 sikweya mamita.
4. Kukura ADAS uye itsva simba motokari, rinosundwa mavhiri maviri, rave kuchengeta motokari zvemagetsi pamusika kukura pamwero vanopfuura 15 muzana pagore ichangopfuura years.Accordingly, pamusika pane pcb kuchapfuurira kumusoro, uye ndicho akafanotaura kuti pagadzirwe pcb achava pfuura $ 4 billion muna 2018, uye kukura muitiro yakajeka zvikuru, Kubayiwawo jekiseni tichimhanya itsva munzvimbo pcb indasitiri.
5. Smartphones kunge mutyairi guru pcb bhizimisi iri past.Mobile Internet yaitonga yakawanda vanoshandisa kubva PC woisa chinouraya zvokushandisa, mamiriro ari PC kadambari pachikuva akakurumidza yatsiviwa Mobile chinouraya, kubva 2008, mutengi yose zvemagetsi zvinoriumba Enterprise yokutsanya kukura, kunyanya muna 2012 ~ 2014, smartphone kupinda nokukurumidza infiltration.Therefore, kukurumidza kukura pcb kunodzorwa nomurwizi pamusoro Mobile zviteshi anomiririrwa akazochena phones.Between 2010 uye 2014, smartphone musika ari nomurwizi pamusoro pcb zvasvika avhareji wepagore remubatanidzwa kukura yevanhu 24%, kure kwazvo kuti nemamwe nomurwizi maindasitiri, ichipa huru vatyairi kukura nokuda pcb indasitiri.
In mukuru-mugumo pcb, HDI Somuenzaniso, serura chinhu chetsika HDI pamusika, muna 2015, somuenzaniso, smartphones chakaita kuti inopfuura hafu kuwanda, uye nemaonero akangwara phones, zviripo mabasa matsva anenge zvigadzirwa zvose vachishandisa HDI sezvo motherboard.
Vose nemaonero pcb uye mukuru-mugumo HDI, ndicho yakakwirira kumhanya smartphone kukura inotungamirira kuti kubudirira vade nomurwizi, nokudaro kutsigira kukura pose pcb nani Enterprises.
Asi hakuna zvaaikanganisa kuti smartphone musika wacho seiyi kubvira 2014, pashure akurumidze infiltration nguva uye zvishoma nezvishoma panopindwa smartphones kupinda wemari era.On mumusika pose, ichangobva for kubva IDC2016 yakabudiswa muna November 2016, munyika yose smartphone zvinyorwa muna 2016 vanotarisirwa kuva mabhiriyoni 1.45, pamwe chinokosha kusvetuka mu ikure 0,6 chete percent.In mashoko kukura data, kunyange zvazvo hafu pcb wacho nomurwizi mafomu dzichiri anotsigirwa mobile phones, vakawanda pcb Mapato, kusanganisira HDI, vave seiyi iri Mobile inouraya nzvimbo.
Kunyange zvazvo munzvimbo yacho upfumi paanochinja, smartphone indasitiri munzvimbo yechipiri hafu iri foregone mhedziso, asi maererano huru kudanda, nokuda muenzaniso mugumisiro vamwe vapemhi kutevera, mutengi kudiwa achadzinga ari replacement.The guru wemari musika kuti akangwara dzeserura achine huru zvinogona, uye vapemhi pakati zviteshi vachaita zvavanokwanisa kuvandudza vatengi 'marwadzo pfungwa kuti kukurudzira vade uye tora pamusika share.As Somugumisiro, akangwara dzorunhare, sezvo huru nomurwizi kushandiswa pcb kare, une mukana mukuru kukura pcb iri huru muganhu wemari.
Mumakore maviri kana matatu akangwara foni kukura muitiro, fingapurindi kukudzwa, 3D Touch, hombe nechidzitiro, hunyambiri kamera nezvimwe kuramba utsanzi yave zvichiitika, asi kuramba kukurudzira yokutsiva ndiwedzere.
Munguva maserura kupinda zera kudanda, guru vhoriyamu hwaro rikasarudza kuti hama kukura anokonzerwa utsanzi Kutengesa pfungwa vacharamba kutungamirira kuwedzera kukuru yakakwana kwazvo demand.Stock pamusoro utsanzi uyewo kunokanganisa pcb pose, kana ramangwana smartphone utsanzi ndiwedzere mu pcb, kukurukura raivapo runharembozha mugadziri rokukurumidzira ainge atumirwa saizi uye vamwe arambe kuchaita, utsanzi ndiwedzere kuda mhanyisa kupinda, saka paaizooneka akafanana Manyiminya, acoustic, etc.
6. Kufunga pcb indasitiri, yaizotangira FPC uye chero paiva interconnection HDI kunokwezva vamwe vagadziri kutevera, uye pfungwa yacho anoratidza kuti pamusoro yokuumba muenzaniso nokukurumidza kupinda:
FPC inonziwo "kusanduka pcb", iri kusanduka polyimide kana polyester firimu chawo zvinhu zvakagadzirwa aida kuchinja akadhindwa redunhu puranga, pamwe mukuru arambe achirema pamusoro wiring, chiedza uremu, ukobvu mutete, aichinja-chinja, mukuru mukana wokushandiswa, Eenhede kuti zvinoitwa lightweight, tefa kuitika electronic chigadzirwa.
Kushandiswa kwaro iPhone kusvika 16 zvidimbu FPC, zvokuvakisa ndiyo pakukura FPC, pamusoro nhanhatu munyika nenyika FPC mugadziri wacho chikuru vatengi vari vagadziri akadai Apple, Samsung, huawei, OPPO pasi mukuratidza apuro uyewo kuvandudza ayo FPC images smartphones.
Smartphones sezvo mukuru Rinokurudzira, kukura FPC zvakunobatsira kubva apuro rayo muenzaniso chaizvoizvo FPC nokukurumidza kutekeshera, 09 anogona kuramba yakakwirira kukura, nerimwe gore kubva pamakore 15 sezvo chete chivara chiri pcb maindasitiri, akava chete zvakanaka kukura chikamu .
7. Substrate-Like pcb (kunzi SLP) muna HDI zvemichina, inobva M-SAP muitiro, anogona zvakare kuchenesa mutsetse, chizvarwa chitsva choupfu mutsetse akadhindwa redunhu bhodhi.
Boka bhodhi (SLP) ndiro runotevera pcb hardboard, izvo zvinogona pfupi kubva 40/40 microns pamusoro HDI kuti 30/30 microns.From muitiro nemaonero, kirasi vachizvitakudza bhodhi pedyo wakashandiswa semiconductor kavha IC bhodhi, asi ane asi kusvika IC of nokurondedzerwa ose mutoro bhodhi, uye chinangwa chawo achiri kutakura ose pusa zvinoriumba, chikuru mugumisiro vachiri ndorwevaya muchikwata of PCB.For ichi chitsva choupfu mutsetse kudhindwa ndiro chikamu, ticha kududzira miganhu matatu ayo imupota background, kugadzira muitiro uye zvinogona suppliers.Why hwaunoda kupinza kirasi mutoro bhodhi: zvikuru yakanatswa mutsetse superposition sveta kavha zvinodiwa, mukuru arambe achirema ichiri huru mutsetse, akangwara phones, mapiritsi, uye wearable namano uye zvimwe zvigadzirwa zvigadzirwa kukudziridza yakananga miniaturization uye muti_function shanduko, kutakura pamusoro nhamba yenhengo ichiwedzerwa kwazvo nokuda redunhu bhodhi nzvimbo, zvisinei, dzakawanda shoma.
Muchirevo chechinyorwa chino, pcb waya upamhi, spacing, ari dhayamita pamusoro micro paneeli uye gomba nepakati kure, uye muitisi rukoko uye pakukora insulating rukoko vanowa, izvo kuti pcb kuderedza kukura, uremu uye bhuku kacho chinogona kutakura zvakawanda components.As mutemo Moore iri kune semiconductors, mukuru arambe achirema ari kuramba kumhanyisana akadhindwa redunhu mapuranga:
Zvikuru zvakawanda redunhu zvinodiwa kupfuura HDI.High arambe achirema inobudisa pcb kunatsiridza mutsetse, uye kukwirira kwenzwi pamusoro bhora (BGA) iri pfupi.
In makore mashoma apfuura, kuti 0,6 mm kusvika 0,8 mm nenamo zvemichina rave kushandiswa Handheld mano, chizvarwa ichi akangwara phones, nokuti kwazvo I / O chinoumba uye chigadzirwa miniaturization, pcb zvikuru ANOSHANDISA mabikirwo 0,4 mm nebhitumini. izvi muitiro ari kukura akananga 0.3mm. Kutaura zvazviri, kukura 0.3mm pakakoromoka michina nokuda Mobile zviteshi akatotora begun.At imwe nguva, kukura micropore uye dhayamita of unobatanidza Disc kunge yaitwa 75 mm uye 200 mm azvaitwa.
Chinangwa The Indasitiri ari kudonhedza micropores uye discs kuti 50mm uye 150mm azvaitwa mune inotevera shoma years.The 0.3mm spacing magadzirirwo Specification kunoda kuti mutsetse upamhi mutsetse uri 30 / 30μm.
iye kirasi bhodhi anofambirana sveta kavha Specification more.SIP hurongwa pamwero kavha michina, kwakavakirwa tsanangudzo dzakawanda semiconductor mutsetse sangano (ITRS): sveta nokuti vakawanda vanoshingaira Electronic dzinoshanda zvakasiyana-siyana optioneel pusa zvinoriumba, uye nezvimwe mano zvakadai MEMS kana zvinoriumba Manyiminya mudziyo pakutanga pamwe chete, kuti vabudirire mumwe basa rimwe chete mwero kavha, kavha michina chokuumba nehurongwa kana subsystem.
Pane Kazhinji mbiri nzira kuziva mashandiro zvigadzirwa ezvinhu, mumwe Soc, uye electronic gadziriro chaitwa pamusoro chete Chip dzakakwirira integration.Another ndiko sveta, izvo integrates CMOS nemamwe matunhu Integrated uye zvemagetsi zvinoriumba ive pasuru kushandisa ruzivo Kubatana kana interconnection zvigadzirwa, izvo zvinogona kuzadzisa muchina wose basa kuburikidza yakafanana kuifukidza-siyana dzichipfekeka Chips.
Boka bhodhi chomumwe pcb hardboard, uye ayo muitiro riri pakati kumusoro kuitira HDI uye IC mundiro, uye namatunhu-mugumo HDI vanogadzira IC bhodhi vagadziri mukana kuitawo.
HDI vagadziri vanonyanya simba, goho achaiswa key.Compared pamwe IC ndiro, HDI kuramba yemakwikwi uye rava dzvuku musika gungwa, pamwe purofiti varikumahombekombe declining.Face boka vachizvitakudza puranga, mukana HDI vagadziri kuti vawane itsva varayirwa, paruoko rumwe, Ukuwo anogona kuona chigadzirwa ndiwedzere, optimizing chigadzirwa kunovhengana uye mwero mari, saka anoda simba, ane simba rokutanga marongerwo.
Nokuda muitiro yepamusorosoro kirasi vachizvitakudza puranga, HDI vagadziri kushandisa kana kugadzira michina mitsva nadzurudzo, uye MSAP muitiro michina nokuda HDI vagadziri kunodawo kudzidza nguva, kubva kubvisa nzira kupinda MSAP, chigadzirwa goho richava chinhu chinokosha.
8. akatungamirira nokukurumidza kukura mukuru chafariz conductivity CCL kuva inopisa spot.The duku spacing akatungamirira ane zvakanakira unspelt, vanoratidza mugumisiro upenyu basa refu hwakanaka uye. Mumakore achangopfuura, izvozvo atanga kutekeshera, uye yave ichikura nokukurumidza. Nokudaro, zvaida yakakwirira chafariz conductivity CCL rava rinopisa nzvimbo.
Motokari pcb pamusoro chigadzirwa yepamusoro uye rakavimbika zvinodiwa kunyatsoteerera chaizvo, uye vakawanda kushandisa chaiyo kuita zvinhu CCL.Automotive zvemagetsi zvinokosha pcb nomurwizi mafomu. Automotive zvemagetsi zvigadzirwa vanofanira kutanga kusangana motokari senzira chokufambisa anofanira hunhu tembiricha, okunze, voltage nokufamba, remagetsi chipingaidzo, vibration nezvimwe adaptive anokwanisa dzakakwirira zvinodiwa kuti motokari pcb zvinhu kuisa mberi yepamusoro zvinodiwa, kushandiswa zvikuru Special waivako zvokuvakisa (akadai mukuru TG zvinhu, Anti-CAF (compressed asbestos faibha) zvinhu, gobvu zvinhu zvemhangura uye zvedongo zvokuvakisa, etc.) CCL.