1. Kamar yadda wani muhimmanci lantarki connector, PCB da ake amfani da kusan duk lantarki da kayayyakin, an dauki "Uwar lantarki tsarin kayayyakin," ta fasaha canje-canje da kuma kasuwar trends sun zama mayar da hankali da hankalin da yawa harkokin kasuwanci.
A halin yanzu, akwai biyu a bayyane yake trends a lantarki da kayayyakin: daya shi ne na bakin ciki da kuma gajere, da sauran shi ne high mita, high gudun drive nisa da tushe PCB daidai da zuwa high yawa, high hadewa, encapsulation, da dabara, da kuma shugabanci na mahara stratification, girma bukatar a saman Layer PCB da HDI .
Top pcb board wiring length is short, low impedance circuit, high-frequency high-speed work, stable performance, can take on more complex function, is to the high frequency electronic technology, multi-function large capacity development inevitable trend.In particular, the in-depth application of large-scale integrated circuits will further drive PCB to high precision and high level.
2. A halin yanzu, PCB ne yafi amfani ga iyali kayan, PC, tebur da kuma sauran lantarki kayayyakin, yayin high-karshen aikace-aikace kamar high yi Multi-hanyar sabobin da Aerospace ana buƙatar su fiye da 10 yadudduka na PCB.Take cikin uwar garke a matsayin misali, da PCB jirgin a kan aure da kuma biyu-hanyar uwar garke ne kullum tsakanin 4-8 yadudduka , yayin da babban kwamitin da high-karshen uwar garke, kamar 4 da kuma 8 hanyoyi, na bukatar fiye da 16 yadudduka , da kuma backplate da ake bukata shi ne a sama 20 yadudduka.
HDI wayoyi yawa dangi zuwa talakawa multilayer PCB kwamitin yana da bayyane abũbuwan amfãni, wanda shi ne babban zabi na mainboard halin yanzu smartphone.Smartphone aiki ƙara hadaddun da girma to hur ci gaba, ƙasa da ƙasa da sarari ga babban jirgin, buƙaci iyakance dauke da karin da aka gyara a kan babban katako, talakawa Multi-Layer jirgin ya kasance wuya ga biyan bukatar.
High-yawa musayar kewaye hukumar (HDI) rungumi dabi'ar laminated doka tsarin jirgin, talakawa multilayer kwamitin a matsayin core hukumar stacking, da yin amfani da hakowa, kuma rami metallization tsari, yin duk yadudduka na line tsakanin ciki dangane aiki. Idan aka kwatanta da na al'ada ta-rami kawai multilayer PCB allon, HDI daidai kafa yawan makafi vias kuma binne vias don rage yawan vias, ceton PCB layout yankin, da kuma muhimmanci ƙara bangaren yawa, ta haka hanzari kammala multilayer aiki a wayoyin salula na zamani Laminating zabi. 
The technical difference of HDI is reflected in the increment stacked number, the more layer quantity, the more difficult the technology.HDI can be divided into single stacked HDI, doule stacked HDI, triple stacked HDI,or high stacked HDI, etc., the number of layers is expressed as C+N+ C, where N is the number of normal core laminar, and C is the number of added layers, namely the stacked number of HDI..High stacked HDI cabling has higher density, but at the same time, it has more pressure, such as position, punch hole and copper plating, etc., which has higher requirements on the technical process and process capability of the manufacturer.
Popular a 'yan shekarun nan a high-karshen smartphone sabani Layer HDI ne mafi girma da suya na HDI, ya bukatar wani da makafi ramuka connection tsakanin m yadudduka, a kan tushen da talakawa HDI zai ajiye kusan rabin masu girma, don haka kamar yadda ya yi karin dakin domin baturi da sauran sassa.
Duk wani Layer na HDI bukatar yin amfani da m fasahar kamar Laser hakowa da kuma Electroplated rami matosai, wanda shi ne mafi wuya samar da mafi darajar-kara HDI type, wanda zai iya mafi kyau daidai da fasaha matakin na HDI. 
Two important trends of the automobile industry are intelligent and electric.ADAS (Advanced Driver Assistance System) as the transition of complete intelligent driving before, has become a major automakers and crossover of Internet giant rushed to the layout of the new strategic highland, it involves the electronic device cover nearly all of the whole vehicle driving and safety related System, with the rapid penetration of ADAS, comprehensive automobile electronic level will be raised.
3. Kuma sabon makamashi motocin da aka wakiltar shugabanci na lantarki mota, idan aka kwatanta da na gargajiya mota, da hakan request na lantarki matakin, na'urorin lantarki a gargajiya limousine halin kaka lissafta game da 25%, 45% zuwa 45% a cikin sabon makamashi motocin , musamman ikon kula da tsarin (BMS, VCU da MCU), sa abin hawa PCB amfani ne ya fi girma fiye da na gargajiya mota, da uku ikon kula da tsarin PCB amfani talakawan na game da 3-5 murabba'in mita, da adadin abin hawa PCB tsakanin 5-8 muraba'in mita.
4. A ci gaba da ADAS da sabon makamashi motocin, kore ta biyu ƙafafun, ya kuma kiyaye mota lantarki kasuwar girma a wani shekara-shekara kudi na fiye da 15 cikin dari a cikin 'yan years.Accordingly, kasuwa na PCB zai ci gaba ɗaya zuwa gaba, kuma shi ne annabta cewa samar da PCB zai wuce $ 4 biliyan a 2018, da kuma ci gaban Trend ne mai haske, alura sabon lokacinta a cikin PCB masana'antu.
5. wayowin komai da ruwan sun kasance wata babbar direba na PCB masana'antu a past.Mobile Internet zamanin, kuma da masu amfani daga PC to mobile m kayan aiki, da matsayi na PC sarrafa kwamfuta dandali da sauri maye gurbinsu da hannu m, tun 2008, duniya mabukaci lantarki da sha'anin azumi ci gaba, musamman a 2012 ~ 2014, smartphone a cikin m infiltration.Therefore, da m girma na PCB aka kore ta da nisa da tushe na mobile tashoshi wakilta mai kaifin phones.Between 2010 da kuma 2014, da smartphone kasuwar a cikin nisa da tushe na PCB kai wani talakawan shekara-shekara fili girma kudi na 24%, yanzu wucewa cewa wasu nisa da tushe masana'antu, samar da babban ci gaban da direbobi ga PCB masana'antu.
A high-karshen PCB, HDI, misali, wayar hannu ne mai gargajiya HDI kasuwar, a 2015, ga misali, wayoyin salula na zamani lissafta ga fiye da rabin da rabo, da kuma ta fuskar smart phones, da ba sabon ayyuka kusan dukan kayayyakin yin amfani da HDI kamar yadda motherboard.
Dukansu ta fuskar PCB da kuma high-karshen HDI, shi ne babban gudun na smartphone girma da take kaiwa zuwa ga ci gaba da bukatar da nisa da tushe, haka goyon bayan ci gaban da duniya PCB amfani Enterprises.
Amma akwai wani musun cewa smartphone kasuwar ta ragae saukar tun 2014, bayan wani m infiltration lokaci da kuma a hankali a hankali shigarwa na wayoyin salula na zamani a cikin stock era.On da duniya kasuwar, da latest forecast daga IDC2016 saki a watan Nuwamba 2016, da duniya smartphone kayayyakin a shekarar 2016 ake sa ran ya zama 1,45 biliyan, tare da wani gagarumin Jump a ci gaban da kawai 0.6 percent.In sharuddan girma data, ko da yake rabin PCB ta da nisa da tushe aikace-aikace har yanzu da goyan bayan wayoyin hannu, mafi PCB Categories, ciki har da HDI, sun ragae a cikin mobile m yankin.
Ko da yake a cikin mahallin da tattalin arzikin, smartphone masana'antu a cikin na biyu rabin ne foregone ƙarshe, amma a kan tushen da manyan stock, saboda da zanga-zanga sakamako sauran dillalai su bi up, mabukaci bukatar zai fitar da replacement.The babban stock kasuwar da smart phones har yanzu yana da makoma, da kuma dillalai daga cikin tashoshi da zai yi da mafi kyau ga inganta masu amfani da 'zafi da maki don haka kamar yadda ta da bukatar da kwace kasuwar share.As a sakamakon, da smart phone, a matsayin babban nisa da tushe aikace-aikace na PCB a baya, yana da babban m ga ci gaban da PCB a cikin babbar stock iyaka.
A cikin shekaru biyu ko uku shekaru na smart phone ci gaba Trend, yatsa fitarwa, 3D Touch, babban allo, dual kamara kuma sauran m bidi'a da aka kunno kai, amma kuma ta ci gaba da ta da maye inganci.
A cikin mahallin da wayoyin hannu shigar da shekaru na stock, da manyan girma akai kayyade cewa zumunta girma sa da} ir} na sayar da maki za har yanzu kai ga wata babbar karuwa a cikin cikakkar yawa na demand.Stock na bidi'a kuma rinjayar duniya PCB, idan nan gaba smartphone bidi'a inganci a PCB, idan akai la'akari da data kasance wayar hannu manufacturer gaggawa kaya size da kuma sauran follow-up za, bidi'a inganci za ta hanzarta shigar azzakari cikin farji, haka bayyana kama da na gani, Ft Irfan, da dai sauransu
6. Yana zuwa da PCB masana'antu, da fashewa daga FPC kuma wani Layer na musayar HDI janyo hankalin sauran masana'antun su bi up, da kuma aya ta haskake da surface samar da wata model na m shigar azzakari cikin farji:
FPC aka sanshi a matsayin "m PCB", shi ne m polyimide ko polyester film tushe abu da aka yi da wani m buga kewaye hukumar, tare da high yawa daga wayoyi, haske nauyi, kauri bakin ciki, m, high sassauci, Catering da Trend na lantarki samfurin hur, m Trend.
Amfani a cikin iPhone up to 16 guda na FPC, samuwa ne a duniya, most FPC, duniya ta saman shida FPC manufacturer ta babban abokan ciniki ne masana'antun kamar apple, samsung, Huawei, Oppo karkashin apple zanga-zanga kuma bunkasa ta FPC of wayoyin salula na zamani.
Wayoyin salula na zamani a matsayin farko tuki da karfi, da girma da FPC ne amfani daga apple da kuma ta zanga-zanga sakamako, FPC hanzari Alhlulbaiti, 09 za su iya kula da high girma, a kowace shekara tun shekaru 15 a matsayin kawai haske tabo a PCB masana'antu, ya zama kawai m girma category .
7. substrate-Like PCB (kira a matsayin SLP) a cikin HDI fasahar, dangane da M-SAP tsari, zai iya kara tata da line, shi ne wani sabon ƙarni na lafiya line buga kewaye hukumar.
A ajin hukumar (SLP) ne gaba tsara PCB hardboard, wanda za a iya taqaitaccen daga 40/40 microns na HDI zuwa 30/30 microns.From aiwatar ra'ayi, aji loading jirgin kusa da amfani a cikin semiconductor marufi IC jirgin, amma yana da yet ya isa IC na dalla na kaya jirgin, kuma da manufar da aka har yanzu dauke dukan m aka gyara, da babban sakamakon da aka har yanzu nasa ne da category na PCB.For wannan sabon lafiya line bugu farantin category, za mu so fassara uku girma na ta shigo da bango, masana'antu tsari da kuma m suppliers.Why yi kana so ka shigo aji kaya jirgin: musamman mai ladabi line superposition SIP marufi da bukatun, high yawa ne har yanzu babban line, smart phones, Allunan, kuma wearable na'urorin da kuma sauran lantarki kayayyakin inganta a cikin shugabanci na miniaturization da muti_function canji, don gudanar a kan yawan aka gyara aka ƙwarai ƙãra ga kewaye hukumar sarari, duk da haka, mafi kuma mafi iyaka.
A wannan mahallin, PCB waya nisa, jerawa, da diamita daga cikin micro panel da rami cibiyar nesa, da kuma shugaba Layer da kauri da insulating Layer suna fadowa, wanda yin PCB don rage size, nauyi da kuma girma na lokuta, shi iya saukar da mafi components.As Moore ta dokar ne don semiconductors, high yawa ne m bin buga kewaye allon:
Musamman cikakken kewaye da bukatun ne ya fi HDI.High yawa gudãnar da PCB su tata line, da kuma farar da ball (BGA) ne taqaitaccen.
A 'yan shekaru da suka wuce, da 0.6 mm to 0.8 mm farar fasahar da aka yi amfani da hannu da na'urorin, wannan ƙarni na smart phones, saboda da yawa daga ina / Yã bangaren kuma samfurin miniaturization, PCB yadu amfani da fasahar da 0.4 mm farar. wannan Trend ne tasowa zuwa 0.3mm. A gaskiya, da ci gaban 0.3mm rata fasahar for mobile tashoshi ya riga ya begun.At lokaci guda, da girman da micropore da diamita na a haɗa Disc an rage zuwa 75 mm da kuma 200 mm bi da bi.
A masana'antu ta manufa shi ne a sauke micropores da fayafai a 50mm, kuma 150mm bi da bi a cikin 'yan gaba years.The 0.3mm jerawa zane jaddadawa bukatar cewa line fadin line ne 30 / 30μm.
ya aji kwamitin ya yi daidai da SIP marufi jaddadawa more.SIP tsarin matakin marufi da fasaha, dangane da definition na kasa da kasa semiconductor line kungiyar (ITRS): SIP ga mahara aiki lantarki da daban-daban ayyuka da kuma tilas m aka gyara, da kuma sauran na'urori kamar MEMS ko Tantancewar na'urar fifiko tare, don cimma wani aiki na guda misali marufi, marufi fasahar samar da wata hanya ko subsystem.
Akwai yawanci hanyoyi biyu don gane da aiki na lantarki tsarin, daya ne SOC, da kuma lantarki tsarin da aka gane a cikin guda guntu da high integration.Another ne SIP, wanda integrates CMOS da sauran Hadakar haihuwarka da kuma kayan lantarki a cikin wani kunshin amfani balagagge hade ko musayar fasaha, wanda za a iya cimma dukan inji aiki ta hanyar da layi daya mai rufi na daban-daban aikin kwakwalwan kwamfuta.
A ajin hukumar nasa ne PCB hardboard, kuma ta aiwatar da shi ne tsakanin high domin HDI da IC farantin, da kuma high-karshen HDI masana'antun da IC kwamitin masana'antun da damar shiga.
HDI masana'antun aka fi tsauri, yawan amfanin ƙasa za a key.Compared da IC farantin, HDI ya zama ƙara m, kuma ya zama ja teku kasuwa, tare da riba ribace-ribace declining.Face da aji loading jirgin, da damar da HDI masana'antun iya samun sabon umarni, a daya hannun, a daya hannun iya yi samfurin inganci, optimizing da samfurin mix da matakin na albashi, saboda haka nufin karfi, mafi iko na farko layout.
Saboda aiwatar mafi girma aji loading jirgin, HDI masana'antun da su zuba jari ko sabon masana'antu kayan aiki gyara, kuma MSAP aiwatar da fasaha domin HDI masana'antun ma bukatar koyon lokaci, daga subtraction Hanyar cikin MSAP, samfurin amfanin ƙasa za a key.
8. LED m cin gaban high thermal watsin CCL zama zafi spot.The kananan jerawa LED yana da abũbuwan amfãni daga unspelt, mai kyau nuni sakamako da kuma dogon sabis rayuwa. A cikin 'yan shekaru, shi ya fara Alhlulbaiti, kuma an girma cikin sauri. Haka kuma, da ake bukata high thermal watsin CCL ya zama wani zafi tabo.
Vehicle PCB a kan samfurin inganci da AMINCI bukatun sosai m, kuma mafi amfani da musamman cika kayan CCL.Automotive lantarki ne mai muhimmanci PCB nisa da tushe aikace-aikace. Automotive lantarki kayayyakin dole ne farko hadu da mota a matsayin hanyar sufuri dole ne suna da halaye na zazzabi, sauyin yanayi, irin ƙarfin lantarki da hawa da sauka, electromagnetic tsangwama, vibration da sauran Na'urar ikon mafi girma da bukatun ga mota PCB kayan sa a gaba mafi girma da bukatun, da yin amfani da karin Special yi kayan (kamar high KU kayan, anti-CAF (matsa asbestos fiber) kayan, m jan kayan da yumbu kayan, da dai sauransu) CCL.