Iindaba Hot Malunga PCB & Assembly

inkqubo unyango ibhodi umphezulu PCB - umahluko phakathi ukuntywiliselwa igolide kunye nesingxobo negolide

 

Kukho iinkqubo eziliqela phezu komhlaba eshicilelweyo ibhodi yesekethe : Ibhodi ze pcb (akukho unyango ngaphezulu), osp, Hot Air intlungu okuyo (elikhokelayo inkcenkce, ukukhokela-free tin), nesingxobo igolide, ukuntywiliselwa igolide njl Ezi zibonakala kakhulu.

Umahluko phakathi ukuntywiliselwa igolide kunye nesingxobo negolide

Ukuntywiliselwa igolide indlela isimemezelo chemical. A umaleko chemical ukhandwa sokungamelani imichiza igcwala-ukuncipha. Ngokubanzi, Ebubanzini eshinyene noko. It is a uhlobo nickel-igolide-igolide indlela ezikroziswayo nokufumba kwemichiza, kwaye ukuphumeza umaleko ngegolide zamafu.

Nesingxobo Gold isebenzisa umgaqo electrolysis, ekwabizwa ngokuba electroplating. Uninzi nezinye zonyango metal komhlaba nayo electroplated.
Nesingxobo Hard Gold Surface Treatment PCB
In the actual product application, 90% of the gold pcb board is the immersed gold pcb board,because the poor solderability of the plated circuit board is his fatal flaw, and it is also the direct cause of many companies to give up the gold plating process!

Inkqubo igolide ukuntywiliselwa efakwe kwi komhlaba kwiibhodi wesekethe eziprintiweyo kunye nombala ezinzileyo, ukukhanya elungileyo, nesingxobo agudileyo, kunye solderability kakuhle nesingxobo nickel yegolide. Ngokomthetho oko lungahlulwa-hlulwa ngezigaba ezine: pre-unyango (ukususwa oyile, micro-ngasekhohlo, ukwenza kusebenze, post-phindiweyo), nickel imvula, igolide enzima, post-unyango (amanzi amdaka, amanzi di, omisa). Ubukhulu igolide emanzini phakathi 0.025-0.1um.

Gold lusetyenziswa unyango kumphezulu iibhodi beesekethe eprintiweyo ngenxa conductivity yalo phezulu zombane, ukumelana igcwala elungileyo, kunye nexesha elide. Ithi zisetyenziswa iibhodi ezingundoqo, umnwe iibhodi igolide pcb, njl Umahluko osisiseko phakathi iibhodi ngegolide engathi ngumfanekiswana kunye neebhodi negolide-shi kukuba nesingxobo igolide nzima. Gold (lingonakali), igolide igolide ethambileyo (bangaziyeki ukumelana).
ukuntywiliselwa ibhodi pcb igolide
1. The crystal structure formed by Immersion Gold and Gold Plating is different. Immersion Gold is much thicker than Gold Plating. Immersion Gold will be golden yellow and yellower than Gold Plating (this is the method of distinguishing between gold plating and heavy gold plating.) a) Gold plating will be slightly white (nickel color).

2. Isakhiwo crystal kuyilwa ngokuntywiliselwa igolide kunye nesingxobo negolide eyahlukileyo. Ukuntywiliselwa igolide kulula ukuba weld ngaphezu nesingxobo negolide ukuvise welding embi. Uxinezeleko Ibhodi immerison legolide kuba lula ukulawula, yaye oko kunokumenza inkqubo lib imveliso yesondo. Ngelo xesha, ngenxa yokuba igolide ngegolide engathi ngumfanekiswana ngaphezu kwegolide, ngomnwe igolide igolide-fingered ayikho wearable (iintsilelo kwipleyiti ngegolide).

3. Kukho kuphela nickel-igolide phezu iphedi kwi igolide-antywiliselwe ibhodi pcb .Le ukudluliselwa uphawu kwi isiphumo lesikhumba aluchaphazeli uphawu kule nwebu yobhedu.

4. ukuntywiliselwa igolide esixineneyo ngaphezu nesingxobo igolide yikristale isakhiwo, akukho lula ukuvelisa igcwala.

5. Ngenxa nemfuno eyandayo eshicilelweyo ibhodi yeseketheaccuracy processing, ububanzi umgca, izithuba sele ifikelele 0.1mm ngezantsi. Nesingxobo Gold othambekele igolide circuit short. I imbasa yegolide kuphela nickel igolide phezu pad, ngoko akukho lula ukuvelisa ngegolide mfutshane wesiphaluka.

6. ukuntywiliselwa yegolide kuphela nickel igolide phezu pad, ngoko ke solder ukuxhathisa kumgca na ngakumbi ngokuqinileyo yesondo esibekwa yobhedu. Le projekthi iza kuchaphazela izithuba xa esenza imbuyekezo.

7 Kuba iimfuno aphezulu nebhodi pcb, iimfuno flatness zingcono, ukusetyenziswa jikelele ngokuntywiliselwa zegolide , ukuntywiliselwa igolide ngokubanzi aliveli emva kokuba ibandla emethini ngumkhuba wabantu abamnyama. Le flatness kunye nenkonzo nobomi imbasa yegolide zingcono kunolo imbasa yegolide.

Ngoko Okwangoku ezininzi iifektri zisebenzise inkqubo igolide ukuntywiliselwa ukuvelisa ibhodi pcb igolide .Kodwa, inkqubo igolide-shi ibiza ngaphezu inkqubo kwegolide-nesingxobo (umxholo igolide ngaphezulu), ngoko kusekho inani elikhulu imveliso eliphantsi ngexabiso ngokusebenzisa iinkqubo zegolide-wazaleka (ezifana iiphaneli remote control, iibhodi zokudlala).

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