Welcome to KingSong PCB Technology
Setšoantšo: 18 le dikarolo High sebetsa ka ho nepahetseng Lines Gold qoelisoa PCB Potoloho Board
Sena PCB Potoloho Board ke 18 le dikarolo High sebetsa ka ho nepahetseng Lines Gold qoelisoa PCB Potoloho Board, sebelisoa ka Control Industrial, ba bang ba joaloka Large Helmets Mainboard, A PCB Potoloho Board ka ho qoelisoa Gold Bokaholimo qeta ke barbotage pakeng tsa motsoako o le se nang letho pcb oa potoloho boto, litsebi tsa rona PCB Manufacturer ha ba feela fana ka ho qoelisoa Gold holim, empa hape HASL-Pele Free, OSP, qoelisoa silevera, qoelisoa Tin jj
1.Detail PCB Manufacturing bokgoni:
| Che |
ntho |
Misa Production |
mochine |
| 1 |
dikarolo |
1-8 le dikarolo |
1-20 dikarolo |
| 2 |
Max. Panel size |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board botenya |
8.5mm |
8.5mm |
| 4 |
Mets. boto botenya |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Mets Inner lera Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
Mets Line bophara |
0.075mm (3/3 mila) |
0.075mm (3/3 mila) |
| 7 |
Mets Line sebaka |
0.075mm (3/3 mila) |
0.075mm (3/3 mila) |
| 8 |
Min.Hole size |
0.15mm (6mil) |
0.15mm (6mil) |
| 9 |
Mets tlotsitsoe lesoba botenya |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Mets Foufetseng / patoa lesoba ka boholo |
0.1mm (4mil) |
0.1mm (1-8layers) (4mil) |
| 11 |
PTH Dia. mamello |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Bao e seng PTH Dia. mamello |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Hole Boemo kheloha |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
boima Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Mets S / M sekontiri se metsi |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
Soldermask mmala |
Green, e ntšo, Blue, White, Yellow, Red |
Green, e ntšo, Blue, White, Yellow, Red |
| 17 |
Silkscreen mmala |
White, Yellow, Red, Black |
White, Yellow, Red, Black |
| 18 |
kemiso |
Routing, V-groove ka, Beveling litebele |
Routing, V-groove ka, Beveling litebele |
| 19 |
kemiso mamello |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
Peelable maske |
Top, tlase, habeli sekamela lehlakoreng le le |
Top, tlase, habeli sekamela lehlakoreng le le |
| 21 |
laoloa Impedance |
+/- 10% |
+/- 7% |
| 22 |
Insulation Khanyetso |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Ka Hole Khanyetso |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
Thermal makala |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Koba le sotha |
≤0.7% |
≤0.7% |
| 26 |
Matla a ea motlakase |
> 1.3KV / limilimithara |
> 1.4KV / limilimithara |
| 27 |
Peel Matla |
1.4N / limilimithara |
1.4N / limilimithara |
| 28 |
Solder Shorts Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
teko gagamalo |
50-330V |
50-330V |
2.PCB etella pele nako: (haeba u hloka tšebeletso potlakileng, re ka boela ra kopana)
| Tlhaloso |
habeli lera |
4 lera |
6 lera |
8 lera |
10 lera kapa ka holimo |
| Sampole (WD) |
4 |
7 |
8 |
10 |
12 |
| Boima tlhahiso ea (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner lephaka paka, Outer tekanyetso lebokose lebokose paka.
4.Shipping:
A: Ka DHL, baholo, FedEx, TNT jj
B: By leoatle bakeng sa palo ka bongata ho ea ka tlhokahalo moreki.
5.If hlokahale khotheishene bakeng sa diporojeke hao PCB, pls fana latelang Info:
A: Quote ngata,
B: Gerber faele ka 274-: x thalong,
C: Technical hlokahalang kapa entsprechen (tse bonahalang, kolohantsoeng, botenya koporo,
boto le tsona ka botenya, holim 'a qetile, solder maske / silkscreen mala ...)
Ha dipatlisiso kapa batla ho ithuta ho eketsehileng, ka kōpo romela ya imeile ho re ka bolokolohi kapa qoqa ke tsamaiso online, leboha bakeng sa tšehetso ea hao esale pele!
