Tongasoa eto amin'ny KingSong PCB Teknolojia
Image: 18 fametrahana mazava Avo sosona-dalana, Gold Ny firobohana lalina PCB Circuit Board
Izany PCB faritra Board dia 18 sosona Avo fametrahana mazava-dalana, Gold Ny firobohana lalina PCB Faritra Board, ampiasaina amin'ny indostria Control, ny sasany toy ny Large Fitaovana Mainboard, A PCB faritra Board amin'ny firobohana lalina Gold tena toetrany vita dia ho mora eo amin'ny singa sy ny mangadihady PCB faritra board, ny matihanina PCB Manufacturer dia tsy vitan'ny hoe manolotra ny firobohana lalina ambonin'ny Gold, fa koa HASL-Lead Free, OSP, ny firobohana lalina volafotsy, ny firobohana lalina Tin sns
1.Detail PCB Manufacturing Capabilities:
| No. |
Item |
Mass Production |
nitranga fahiny |
| 1 |
sosona |
1-8 sosona |
1-20 sosona |
| 2 |
Max. Panel Size |
600 * 770mm (23.62 "* 30,31") |
600 * 770mm (23.62 "* 30,31") 500 * 1200mm (19.69 "* 47,24") |
| 3 |
Max.Board hateviny |
8.5mm |
8.5mm |
| 4 |
Min. Board hateviny |
2L: 0.3mm,
4L: 0.4mm,
6L: 0.8mm |
2L: 0.2mm,
4L: 0.4mm.
6L: 0.6mm |
| 5 |
Min Inner Layer Clearance |
0.1mm (4mil) |
0.1mm (4mil) |
| 6 |
Min-dalana, sakany |
0.075mm (3/3 Mil) |
0.075mm (3/3 Mil) |
| 7 |
Min-dalana, toerana |
0.075mm (3/3 Mil) |
0.075mm (3/3 Mil) |
| 8 |
Min.Hole Size |
0.15mm (6mil) |
0.15mm (6mil) |
| 9 |
Min nopetahany takela lavaka hatevin'ny |
20um (0.8mil) |
20um (0.8mil) |
| 10 |
Min Blind / Nalevina haben'ny lavaka |
0.1mm (4mil) |
0.1mm (1-8layers) (4mil) |
| 11 |
Dia PTH. fandeferana |
± 0.076mm (± 3mil) |
± 0.076mm (± 3mil) |
| 12 |
Non PTH Dia. fandeferana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 13 |
Hole Position fahadisoan-dàlana |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
| 14 |
Heavy Coppe |
4oz / 140μm |
6oz / 175μm |
| 15 |
Min S / M dity |
0.1mm (4mil) |
0.1mm (4mil) |
| 16 |
Soldermask loko |
Green, mainty, Blue, White, Yellow, Red |
Green, mainty, Blue, White, Yellow, Red |
| 17 |
Silkscreen loko |
White, Mavo, Mena, Black |
White, Mavo, Mena, Black |
| 18 |
drafitra |
Tambazotra, V-Groove, Beveling totohondriny |
Tambazotra, V-Groove, Beveling totohondriny |
| 19 |
Outline Tolerance |
± 0.15mm ± 6mil |
± 0.15mm (± 6mil) |
| 20 |
Peelable saron-tava |
Top, ambany, misy rindrina avo roa heny |
Top, ambany, misy rindrina avo roa heny |
| 21 |
voafehy Impedance |
+/- 10% |
+/- 7% |
| 22 |
Insulation Fanoherana |
1 × 1012Ω (Normal) |
1 × 1012Ω (Normal) |
| 23 |
Amin'ny alalan'ny Hole Resistance |
<300Ω (Normal) |
<300Ω (Normal) |
| 24 |
mafana dona |
3 × 10sec @ 288 ℃ |
3 × 10sec @ 288 ℃ |
| 25 |
Tenany sy ny heviny |
≤0.7% |
≤0.7% |
| 26 |
Electric Strength |
> 1.3KV / MG |
> 1.4KV / MG |
| 27 |
Peel Strength |
1.4N / MG |
1.4N / MG |
| 28 |
Solder Mask Abrasion |
> 6H |
> 6H |
| 29 |
Flammability |
94V-0 |
94V-0 |
| 30 |
Test TOSIKARATRA |
50-330V |
50-330V |
2.PCB nitarika ny fotoana: (raha toa ka mila maika fanompoana, isika ihany koa dia afaka hihaona)
| Description |
Double Layer |
4 Layer |
6 Layer |
8 Layer |
10 Layer na ambony |
| Sample (WD) |
4 |
7 |
8 |
10 |
12 |
| Lamesa famokarana (WD) |
7-9 |
10-12 |
13-15 |
16 |
20 |
3.Package: Inner banga fonosana, fitsipika ivelany boaty baoritra fonosana.
4.Shipping:
A: By DHL, UPS, Fedex, TNT sns
B: Ny ranomasina ho an'ny faobe be araka ny mpanjifa ny fepetra.
5.If mila PCB teny nindramina ho an'ny tetikasa, pls manome manaraka Info:
A: Quote dia be,
B: Gerber ampy amin'ny 274-X endrika,
C: fepetra ara-teknika na ny masontsivana (ara-nofo, sosona, varahina hatevin'ny,
birao hatevin'ny, ambonin'ny famaranana, solder saron-tava / silkscreen loko ...)
Raha misy manontany na te-hianatra bebe kokoa, azafady handefa mailaka ho antsika malalaka na hiresaka an-tserasera amin'ny alalan'ny rafitra, Misaotra noho ny fanohanana mialoha!
