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1.0mm botenya 96% ea alumina Ceramic PCB Manufacturing thepa


  • Lebitso cha: KingSong / Customized
  • Min.Order palo: No
  • Phepelo Matla: 30 ~ likete tse 50 ㎡ / Khoeli le Khoeli
  • Port: Shenzhen
  • Tšebeletso: EMS / OEM / ODM
  • Terms tefello: T / T, PayPal, Wu jj
  • Lera: 1
  • Base Material: 96% ea alumina Ceramic
  • Boto botenya: 1.0mm
  • Thermal conductivity: 20 ~ 27 W / mk la
  • Holim qete: Immersion Silver
  • hlalosa

    Welcome to  KingSong PCB Technology

    Setšoantšo: 1.0mm botenya 96% ea alumina Ceramic PCB Manufacturing thepa

    Ceramic PCB Price

     

    1.Ceramic PCB Board bokgoni:
    Layer:1,2
    Material:96% Alumina,99% Aluminium nitride(AIN),Sapphire,High Borosilicate Glass
    Material Thickness(mm):0.38,0.635,0.5,1.0,1.2,1.5
    Material Size(mm):120*120,127*127,132*132,140*130,190*140
    Min Hole:0.075mm
    Min Line width/space:0.1/0.1mm
    Laser Outline: line width:0.1mm,tolerance:+/-0.1mm
    Surface Finish:Immersion Silver,Immersion Gold,Immersion Tin,OSP
    Copper Thickness(oz):H/H  1/1  2/2  3/3  4/4  5/5  6/6  7/7  8/8  9/9  10/10
    Thermal conductivity value:  20~27W/m.K for Alumina; 180W~220W/m.K for Aluminium nitride , 27~30W/m.K for Sapphire,2 ~ 5 W/m.K for High Borosilicate Glass

    Product Tlhaloso:
    Ceramic PCB ke phahameng mogote conductivity substrate entsoe ka phahameng-conductivity dielectric oa potoloho entsoe ka tšepe le likelello le phahameng mogote conductivity kokabolaka tse bonahalang, ka ka tsela e atlehang ho rarolla bothata ba ho tlaase mogote conductivity PCB le aluminium substrate. Ho ka tsela e atlehang futhumatsa mocheso generated ka phahameng mocheso dikarolo tsa elektronike, eketsa karolo botsitso le lelefatsa bophelo ba tšebeletso ena.

    Product Features:
    Do not need to change the original processing procedures
    Excellent mechanical strength
    With good thermal conductivity
    With resistance to erosion
    Good surface characteristics, excellent flatness and flatness
    Good thermal shock resistance
    Low curl degree
    Good stability under high temperature can be processed into a variety of complex shapes

    Kopo:
    high-accuracy clock oscillator,
    voltage controlled oscillator (VCXO),
    temperature compensated crystal oscillators (TCXOs),
    oven controlled crystal oscillators (OCXOs);
    emiconductor cooler;
    electric power electronic control module;
    high insulation & high pressure device;
    high temperature (up to 800C)
    high power LED
    High Power semiconductor modules
    solid state relay (SSR)
    DC-DC module power sources
    electric power transmitter modules
    Solar-panel arrays

    Bohlale matla disebediswsa
    Automotive electronics
    High power semiconductor module
    Solar panel components
    Lighting industry
    Aerospace
    Communications
    The power electronics industry

    2.Delivery nako:
    Sample:3-5 or 12-15 working days,
    Mass production:5-7 or 12-15 working days

    3.Package: Inner lephaka paka, Outer tekanyetso lebokose lebokose paka.

    4.Shipping:
    A: Ka DHL, baholo, FedEx, TNT jj
    B: By leoatle bakeng sa palo ka bongata ho ea ka tlhokahalo moreki.

    5.If hlokahale khotheishene bakeng sa diporojeke hao PCB, pls fana latelang Info:
    A: Quote ngata,
    B: Gerber faele ka 274-: x thalong,
    C: Technical hlokahalang kapa entsprechen (tse bonahalang, kolohantsoeng, botenya koporo,
    boto le tsona ka botenya, holim 'a qetile, solder maske / silkscreen mala ...)

    Ha dipatlisiso kapa batla ho ithuta ho eketsehileng, ka kōpo romela ya imeile ho re ka bolokolohi kapa qoqa ke tsamaiso online, leboha bakeng sa tšehetso ea hao esale pele!