1. Kutheni tyaba kakhulu imfuneko ibhodi yesekethe
In kumgca yokufaka oluzenzekelayo, ukuba ibhodi yesekethe yoshicilelo ayikho tyaba, oko kuya kubangela ukuba indawo asichanekanga, amacandelo asikwazi kufakwa emngxunyeni kunye umphezulu kwipleyiti, kwaye kwiplagi oluzenzekelayo loader.When ibhodi pcb ababekhonza candelo welding emva ngelotha, kwaye unyawo element kunzima kunqunyulwa kwibhodi PCB neatly.The nayo ayikwazi ukuba ifakwe kwibhokisi umatshini okanye kwisokethi kwi ngomatshini, ngoko, le pcb ibandla mveliso intlanganiso ipleyiti ugwenxeke kwaphela nalo troublesome.At kakhulu langoku, i ibhodi yesekethe yoshicilelo uye wangena era yofakelo komhlaba kunye nofakelo chip, kwaye wesekethe ibhodi indibano izityalo eprintiweyo kufuneka ibe ngaphezulu kwaye ngqongqo ngakumbi nemfuno of plate babenobuzwe.
2. Iindlela ImiGangatho kunye novavanyo ukuze lokoluka
Ngokutsho United States IPC-6012 (uhlelo 1996) << ngqongqo eshicilelweyo ukuchongwa webhodi yesekethe kunye nokubalulwa yokusebenza >>, lo warping ubuninzi avumelekile kunye uhlaba wobuso eqhubekayo ipleyiti yi-0.75%, nabo bonke nezinye iibhodi pcb zivumelekile 1.5% .Oku kuye kwanda iimfuno kumphezulu eqhubekayo ibhodi nembasa-IPC-RB-276 (1992 version) tivela langoku, inqanaba lokoluka welayisenisi nganye elektroniki pcb ibandla yezityalo, kungakhathaliseki kabini okanye multi-umaleko pcb, 1.6mm babulingana nesandla, ngokuqhelekileyo 0,70 ~ 0.75%, abaninzi SMT, BGA nembasa, mfuneko 0.5% .Abanye elektroniki mveliso ukuba umoya wokuba ukunyuka 0.3 ekhulwini kwemigangatho warping, kunye namanyathelo test warping landela gb4677. 5-84 okanye ibhodi PCB IPC-t-650.2.4.22b.Put kwiqonga luqinisekisiwe, uvavanyo inaliti nendlela Ubungakanani bendawo inkulu, ekuvavanyeni ubukhulu yenaliti, bahlulwe ubude negophe beplanga PCB, naselusingeni lokoluka degree of ibhodi yesekethe eprintiweyo kungaba ibalwe.
3. Warping ngexesha lemveliso inkqubo
yoyilo 1. Engineering: uyilo beplanga yesekethe yoshicilelo uya maziqatshelwe:
A. lilungiselelo prepreg phakathi maleko kufuneka ibe macala, ezifana laminates ezintandathu PCB Board , Ebubanzini 1 ~ 2 kunye 5 ~ 6 maleko kufuneka kungqinelane inani amaqhekeza semi-eqina, kungenjalo uxinzelelo umaleko kuya kuba lula nendlela.
B. Multi-ngaplastiki pcb engundoqo kunye namacwecwe semi-waphilisa ziya kusetyenziswa kwiimveliso kumthengisi omnye lowo.
C. Ummandla imigca A and B engaphandle kufuneka abe kufutshane nje possible.If A ubuso A umphezulu ubhedu enkulu, yaye B kuphela A imigca embalwa, kwipleyiti kulula ukuba lokoluka emva etching.If emacaleni omabini umahluko indawo line mkhulu kakhulu, ungadibanisa ezinye igridi akanankathalo kwicala ezinqinileyo, ukuze balance.
2, ibhodi yokubhaka phambi kokuba kusikwe:
CCL ibhodi yokubhaka pcb phambi kokuba kusikwe (degrees 150, 8 ± 2 iiyure) ukulungiselela injongo ukususa ukufuma ngaphakathi ebhodini, iyime intlaka waphilisa ngaphakathi esityeni, ngakumbi ukuphelisa uxinzelelo ntsalela plate, apho kuluncedo ukuthintela ibhodi warping.At langoku, abaninzi pcb kabini-Amasa, iibhodi pcb multi-umaleko nangoku zilandele ngqo le pre-blanking okanye post-ukubhaka step.But kukho ezinye mveliso lokuvelisa ibhodi pcb, ngoku ibhodi pCB yesekethe mveliso ibhodi yokubhaka imithetho sihlandlo azingqinelani, ukusukela iiyure ezi-4 ukuya ku-10, wacebisa ukuba iklasi ngokutsho imveliso eshicilelweyo ibhodi yesekethekunye nemfuno lwabathengi izidanga lokoluka ukuba decide.Cut zibe ziingceba okanye emva yonke intwana ukubhaka ukubhaka kunqunyulwa eziko le izinto, iindlela ezimbini zinako ukufikeleleka, kucetyiswa usika ibhodi emva ahlabayo. Ibhodi yangaphakathi kufuneka ibe iyoma ibhodi.
3. Le eziqondileyo kunye weft of prepreg:
Emva kokuba lamination prepreg, lo shrinkage lokoluka kunye weft imiyalelo yahlukile, kwaye lokoluka kunye weft imiyalelo kufuneka yohlulwe xa blanking kunye stacking.Otherwise, kulula ukuba lokoluka kwipleyiti ogqityiweyo emva wokulaminetha, nokuba nzima ukulungisa. Multi-Umaleko pcb yezizathu warping, abaninzi lamination le prepreg xa lokoluka kunye weft zange umahluko phakathi, uphindaphindo ngokungakhethi okubangelwa.
Indlela ukwahlula phakathi yesibanzi neside? Roll prepreg Eyisongile kubaluleke naselusingeni lokoluka, kwaye ulwalathiso Ububanzi weft; ibhodi ngefoyile ye yobhedu kwicala elide latitudinal, Icala elifutshane lokoluka, ukuba akuqinisekanga ukuba buza umvelisi okanye kumthengisi.
4. Uxinzelelo emva wokulaminetha:
Ibhodi pcb multilayer, emva ekuzalisekeni abandayo-cofa cut okanye wekhaya Isipha ashushu-inki, ngoko ncwaba ukubhaka kwi izidanga eziko 150 Celsius iiyure 4, ukuze noxinezeleko intraplate ngcembe ukukhulula kwaye wenze le nentlaka ela- , eli nyathelo lishiyiwe.
5. Isidingo ukuqondisa imbasa ngelixa wazaleka:
0.4 ~ 0.6mm obhityileyo ibhodi pcb multi-umaleko ngenxa nesingxobo kwibhodi yesekethe kunye nesingxobo graphic kufuneka zenziwe umqulu NIP ezizodwa, oluzenzekelayo nesingxobo umgca phezu ikliphu Feiba kwimakhishithi, kunye ibha ngeenxa yonke ikliphu kwi Fiba i umtya sele enziwe kunye yokulungisa zonke iibhodi wesekethe eshicilelweyo kwi ahambise ukuze amacwecwe Black akayi ukugqabhuza. Ngaphandle le ndlela yokulinganisa, emva wazaleka microns amabini okanye amathathu maleko yobhedu, iphepha uya zogotywa, kwaye kunzima kuncedwa.
6. IBhodi okupholisa emva umoya sokulinganisa hot:
Umoya eshushu eshicilelweyo ibhodi yesekethe liyachatshazelwa lobushushu eliphezulu kumkhombe solder (malunga 250 degrees Celsius). Emva kokuba lisuswe, kufuneka ufakwe kwi flat marble okanye intsimbi ipleyiti ukupholisa ngokwemvelo, waza ke umatshini post-processing yi cleaned.This kulungile warping ka boards.Some mveliso ukuphucula njengokukhazimla umphezulu lead , inkcenkce, ibhodi emanzini abandayo, ngoko nangoko emva kokuba umoya sokulinganisa ashushu emva kwemizuzwana embalwa apha kwakhona, nomkhuhlane onjalo nothuke kubanda, kwiindidi ezithile iibhodi kungenzeka ukuvelisa warping, ukongeza sekhombuya okanye blister.In, i umandlalo lencopho umoya zingadityaniswa Ukupholisa izixhobo.
7. warping yebhodi processing:
Xa mveliso nezilawulwa kakuhle, ibhodi iya kuba 100% flatness ujonge kwi uhlolo lokugqibela. Zonke iibhodi engamkelekanga pcb iza sathathwa, ibekwe lezonka, zosiwe ngama 150 uxinzelelo Celsius kwaye enzima kangangeeyure ezi-3 ukuya ku-6, naphantsi xi lungapholi zendalo. Emva koko esemi ipleyiti kunye nokususa ibhodi pcb, xa itshekhi flatness, kangangokuba inxalenye ibhodi asindiswe, yaye ezinye kwiibhodi wesekethe eziprintiweyo kufuneka babe izihlandlo ezimbini ukuya kwezintathu kulo ukubhaka ukuze level.If elilwa ikhankanywe ngasentla -warping amanyathelo inkqubo na ukusebenza, ezinye ibhodi ukubhaka 'into ngamampunge, mmeli kuphela.