1. No ke aha la o ka huakai kaapuni papa koi loa i lalo
I ka 'akomi hookomo laina, ina ka pai huakai kaapuni papa mea e palahalaha, ka mea e i ka wahi e e paʻewa, na eiiiiiaiou hiki ole ke hookomo i loko o ka lua a me ka ili o ka una honua, a hiki i ka 'akomi polokalamu loader.When ka pcb papa i akoakoa ke keʻena ua welded ma hope o soldering, a me ka wāwae o ka hehee ai mea ole ia eʻoki pū hiki ole ke hoʻouka kekahi neatly.The pCB papa i loko o ka mīkini pahu paha ke kumu i loko o ka mīkini, no laila, i ka pcbʻaha kanaka hola hālāwai papa maʻawe loloa, ka hoi loa troublesome.At kēia manawa, ke pai huakai kaapuni papa i komo i ke au o ka 'ilikai mea hoʻonoho a me ka? inoaia mea hoʻonoho, a pono e hou a me ka oi o ka ikaika me ke koi i ka pai ia huakai kaapuni papaʻaha kanaka kanu o ka una honua maʻawe loloa paha.
2. Koo a me ka ho'āʻo epekema no ka maʻawe loloa
E like me ka United States IPC-6012 (1996 Edition) <<ʻoʻoleʻa i paiia kaapuni papa 'ike a me ka hana ana hoakaka >>, ka allowable i kā mākou warping a me ka ei o ka ili ka piʻiʻana papa o 0,75%, a me nā mea a pau nā pcb papa i 'ae' 1.5% .This ua mahuahua na koi no ka ili ka piʻiʻana papa ka papa o ka ipc-rb-276 (1992 kēia) .At makana, o ka maaweloloa degere o ka laikini o kēlā me kēia lolouila pcbʻaha kanaka mea kanu,ʻaʻohe mea papalua no hoi lakou a nunui-, ahu iho pcb, 1.6mm mānoanoa, IeAUPIIe, IAa IO ~ 0,70 0,75%, he nui SMT, BGA papa, ke koi nei 0.5% .Some uila no nā hale hana e hoohaunaele i ka 0,3 pakeneka mahuahua ma ka warping hae, a me ka hoao ana warping ana ma hope gb4677. 5-84 a ipc-TM-650.2.4.22b.Put PCB papa ma ka hōʻoia paepae, i ka hoao ana kui kele ma e maaweloloa degere o ka nui kūloko, e hoao i ka anawaena o ke kuikele, puunaueia e ka hālawa lōʻihi o ka PCB papa, maaweloloa degere o ka pai huakai kaapuni papa hiki ke pōpilikia.
3. Warping i manufacturing kaʻina
1. 'enekinia, i manao ai: i ka manao o ke pai huakai kaapuni papa e e kaulana:
A. ka hoʻoponoponoʻana o Kamehameha no ka prepreg ma waena o nā papa e e symmetrical, e like me ka laminates eono PCB Papa , o ka mānoanoa o ka 1 ~ 2 a me 5 ~ 6 papa mau pahuhopu nei me ka helu o ke kalaka nui-solidified apana, ai ole i ka ahu iho la ka puʻuwai e e oluolu i ka maʻawe loloa.
B. nunui-ua laminekaʻia kāna mau 'ōlelo pcb, a e hoʻohana' e kalaka nui-ola o na papa io o ka mea hookahi wale mai ana o nā huahana.
C. ka wahi o ka mea ma waho A a me B laina e e like kokoke me possible.If A maka o A nui keleaweʻilikai, a me B mea wale A mau laina, o ka una honua mea oluolu i ka maʻawe loloa ma hope o etching.If na aoao elua o ka laina āpana like ka nui nui, e hiki ke hui aku i kekahi indifferent maka aha ma kaʻaoʻao wīwī, ma ka mea e kaulike.
2, hana kālua papa mua oki:
CCL baking pcb papa mua oki (150 degere, 8 ± 2 hola) no ka hana mea e wehe i ka ona mau i loko o ka papa, a e ke kēpau, hoola iho la i loko o papa, no hoi ke kāpaeʻana koena stress ma ka pa, a mea kōkua maikaʻi, e pale aku i ka papa warping.At makana, he nui waʻa-mńlualua pcb, nunui-, ahu iho pcb papa nō hoopili aku i ka mālama '-blanking a kia-kālua step.But he mea no hoi kekahi pcb papa manufacturing hola, e ka PCB huakai kaapuni papa hola baking papa manawa rula i kue, HEN, mai 4 a hiki i 10 hola,? aaeaaaaony i ka papa, e like me ka? iecaianoaaiiie o pai huakai kaapuni a ka papaa me ka Customer koi no ka maʻawe loloa degere e decide.Cut i liilii paha ma hope o ka'āpana kālāʻokoʻa o ka hana kālua hana kālua umu, e oki i ka mea, i nā kiʻina hana mau i hiki, ka mea, ua pono ke kalai papa ma hope o oki. Na lilo o ka papa E hoi e maloʻo ana ka moku.
3. ka maʻawe loloa, a weft o prepreg:
Ma hope o ka prepreg lamination, ka shrinkage i loko o ka maʻawe loloa, a weftʻaoʻao mea okoa, a me ka pono e hookoaia ka maʻawe loloa, a weft kuhikuhi ia blanking a me stacking.Otherwise, ia mea oluolu i ka maʻawe loloa i ka pau una ma hope o laminating, a ina ia mea paakiki ke ao. Nunui-, ahu iho pcb warping kumu, he nui no ka lamination o ka prepreg ka wā o ka maʻawe loloa, a weft i ole maopopo ma waena, indiscriminate duplication kena ae la ia e.
Pehea eʻike ma waena o latitude a me longitude? Roll prepreg olokaa i ka kuhikuhi ana o ka maaweloloa, a me ka laula kuhikuhi ana o ka weft; keleawe pepa kini ka papa no kaʻaoʻao lōʻihi o ka latitudinal, pōkoleʻaoʻao ka maaweloloa, ina eʻoiaʻiʻo, e nānā me ka Hookah a wale mai ana.
4. ka hoʻonaʻauao ma hope o laminating:
multilayer pcb ka papa, e hooko ana i ka wela-ua e ke anu-kaomi oki paha mīkini wili pōhaku burrs, laila, i lalo i kālua i loko o ka umu 150 kekelē Kelekia ma no 4 hola, no laila, i ka intraplate stress i nā hookuu a e ke kēpau, hoola iho la ma hope o , keia anu u ua hōʻike pū 'ana.
5. Pono e straighten i ka lahilahi una ana plating:
0,4 ~ 0.6mm lahilahi nunui-, ahu iho pcb ka papa no ka huakai kaapuni papa plating a Kimia plating E e i ka kūikawā nip'ōwili, 'akomi plating laina ma ka Feiba Clip ma luna o ka pepa, a me ka a 'aukā i ka holoʻokoʻa Clip ma ka Fiba nā kaula i kui pu e straighten a pau i ka pai ia huakai kaapuni papa ma luna o ka lole wili no laila, i ka mau pale papa e mai ino. Me keia ana, ma hope o plating he iwakalua kanakolu paha microns o ke keleawe, ahu iho, me ka pepa e e lena, a me ka pilikia no e ola ai.
6. Papa anuanu maila ma hope o wela ea hoohaahaaia iho la:
Ka wela ke ea o ka pai huakai kaapuni a ka papa ua loli ana ma ke ana wela kiʻekiʻe o ka solder pa (ma kahi o 250 kekelē Kelekia ma). Ka mea, ua weheʻia ma hope, ka mea e e hoʻokomo i loko o ka i lalo kinikini paha kila papa e hoomaalili maoli ai, a laila, i ke kia-aaioee mīkini o cleaned.This mea maikai no ka warping o boards.Some hola e hōʻoi 'i ka olinolino o ka ili o ke kēpau , ke tina, ke papa i loko o ka wai anu, koke ma hope o wela ea hoohaahaaia iho la mai ma hope o kekahi mau kekona i loko o ka reprocessing, ua i kuni i ke anu kŰia, no kekahi mau 'ano o nā papa hoʻoneʻe' ia paha i ka paka warping, pona a blister.In hou, i ka ea lana moe hiki ke huiia, e hooluolu i ka lako a pan.
7. warping papa aaioee:
Ma kekahi luawai-e hoʻokele hola, i ka papa, e i ka 100% flatness ponopono ma ka nana hope loa. All unacceptable pcb papa e e hapai mai, waiho i loko o ka umu, pulehu ma 150 kekelē Kelekia ma, a kaumaha puʻe i 3 me 6 hora, a ma lalo o ka puʻe o maoli ka huʻihuʻiʻana. A laila, unload i ka una honua, a wehe i ka pcb papa, ma o ka flatness ponopono, no laila, ua hapa o ka papa hiki ke ola, a me kekahi pai kaapuni papa Pono e mau no ekolu manawa i ka hana kāluaʻia i mea e level.If i ka luna-i oleloia Anati -warping kaʻina ana mea i hoʻokō, kekahi papa baking mea lapuwale, wale scrapped.